HUF75309T3ST

MOSFET 19a 55V N-Channel UltraFET

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SeekIC No. : 00163941 Detail

HUF75309T3ST: MOSFET 19a 55V N-Channel UltraFET

floor Price/Ceiling Price

Part Number:
HUF75309T3ST
Mfg:
Fairchild Semiconductor
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/25

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 55 V
Gate-Source Breakdown Voltage : +/- 20 V Continuous Drain Current : 19 A
Resistance Drain-Source RDS (on) : 0.07 Ohms Configuration : Single Dual Drain
Maximum Operating Temperature : + 150 C Mounting Style : SMD/SMT
Package / Case : SOT-223 Packaging : Reel    

Description

Transistor Polarity : N-Channel
Gate-Source Breakdown Voltage : +/- 20 V
Mounting Style : SMD/SMT
Packaging : Reel
Maximum Operating Temperature : + 150 C
Drain-Source Breakdown Voltage : 55 V
Continuous Drain Current : 19 A
Package / Case : SOT-223
Configuration : Single Dual Drain
Resistance Drain-Source RDS (on) : 0.07 Ohms


Features:

• 3A, 55V
• Ultra Low On-Resistance, rDS(ON) = 0.070W
• Diode Exhibits Both High Speed and Soft Recovery
• Temperature Compensating PSPICE™ Model
• Thermal Impedance SPICE Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Related Literature
- TB334, "Guidelines for Soldering Surface Mount Components to PC Boards"



Specifications

 
UNITS
Drain to Source Voltage (Note 1)
VDSS
55
V
Drain to Gate Voltage (RGS = 20kW) (Note 1)
VDGR
55
V
Gate to Source Voltage
VGS
±20
V
Drain Current Continuous (Figure 2).
ID
3
A
Drain Current Pulsed Drain Current
IDM
Figure 5
Pulsed Avalanche Rating
EAS
Figures 6, 14, 15
Power Dissipation
PD
1.1
W
Derate Above 25oC
9.09
W/
Operating and Storage Temperature
TJ,TSTG
-55 to 175
Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s.
TL
300
Package Body for 10s, See Techbrief 334
Tpkg
260
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. TJ = 25 to 125.



Description

This N-Channel power MOSFET HUF75309T3ST is manufactured using the innovative UltraFET™ process. This advanced process technology achieves the lowest possible on-resistance per silicon area, resulting in outstanding performance. This device is capable of withstanding high energy in the avalanche mode and the diode exhibits very low reverse recovery time and stored charge.HUF75309T3ST was designed for use in applications where power efficiency is important, such as switching regulators, switching converters, motor drivers, relay drivers, lowvoltage bus switches, and power management in portable and battery-operated products.




Parameters:

Technical/Catalog InformationHUF75309T3ST
VendorFairchild Semiconductor
CategoryDiscrete Semiconductor Products
Mounting TypeSurface Mount
FET PolarityN-Channel
Drain to Source Voltage (Vdss)55V
Current - Continuous Drain (Id) @ 25° C3A
Rds On (Max) @ Id, Vgs70 mOhm @ 3A, 10V
Input Capacitance (Ciss) @ Vds 352pF @ 25V
Power - Max1.1W
PackagingTape & Reel (TR)
Gate Charge (Qg) @ Vgs23nC @ 20V
Package / CaseSOT-223, SC-73, TO-261 (3 Leads + Tab)
FET FeatureLogic Level Gate
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names HUF75309T3ST
HUF75309T3ST



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