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HUF75307P3, HUF75307S, HUF75307T3S136

Table of contents:
Info of HUF75307P3
Info of HUF75307S
Info of HUF75307T3S136

HUF75307P3, HUF75307S, HUF75307T3S136 Selling Leads, Datasheet

MFG:Fairchild Package Cooled:N/A D/C:09+

HUF75307P3, HUF75307S, HUF75307T3S136 Picture

HUF75307P3, HUF75307S, HUF75307T3S136 Datasheet download

Five Points

Part Number: HUF75307P3

MFG: Fairchild

Package Cooled: N/A

D/C: 09+

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HUF75307P3 General Description

These N-Channel power MOSFETs are manufactured using the innovative UltraFET™ process. This advanced process technology achieves the lowest possible on-resistance per silicon area, resulting in outstanding performance. This device is capable of withstanding high energy in the avalanche mode and the diode exhibits very low reverse recovery time and stored charge. It was designed for use in applications where power efficiency is important, such as switching regulators, switching converters, motor drivers, relay drivers, lowvoltage bus switches, and power management in portable and battery-operated products.

HUF75307P3 Maximum Ratings

				UNITS
Drain to Source Voltage (Note 1)		VDSS	55	V
Drain to Gate Voltage (RGS = 20kW) (Note 1)		VDGR	55	V
Gate to Source Voltage		VGS	±20	V
Drain Current Continuous (Figure 2).		ID	15	A
Drain Current Pulsed Drain Current		IDM	Figure 4
Pulsed Avalanche Rating		EAS	Figures 6, 14, 15
Power Dissipation		PD	45	W
Derate Above 25			0.3	W/
Operating and Storage Temperature		TJ,TSTG	-55 to 175
Maximum Temperature for Soldering	Leads at 0.063in (1.6mm) from Case for 10s.	TL	300
Maximum Temperature for Soldering	Package Body for 10s, See Techbrief 334	Tpkg	260

CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

HUF75307P3 Features

• 15A, 55V
• Simulation Models
- Temperature Compensated PSPICE^® and SABER^© Models
- SPICE and SABER Thermal Impedance Models Available on the WEB at: www.semi.Intersil .com/families/models.htm
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Related Literature
- TB334, "Guidelines for Soldering Surface Mount Components to PC Boards"

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