BSS 123, BSS101578, BSS1125-A-TBB/83.330 Selling Leads, Datasheet
MFG:ON Package Cooled:06+
BSS 123, BSS101578, BSS1125-A-TBB/83.330 Datasheet download
Part Number: BSS 123
MFG: ON
Package Cooled: 06+
D/C:
BSS 123, BSS101578, BSS1125-A-TBB/83.330
- Table of contents:
Info of BSS 123
Info of BSS101578
Info of BSS1125-A-TBB/83.330
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About BSS100
PDF/DataSheet Download
Datasheet: BSS100
File Size: 291374 KB
Manufacturer: SIEMENS [Siemens Semiconductor Group]
Download : Click here to Download
About BSS100
PDF/DataSheet Download
Datasheet: BSS100
File Size: 291374 KB
Manufacturer: SIEMENS [Siemens Semiconductor Group]
Download : Click here to Download
About BSS100
PDF/DataSheet Download
Datasheet: BSS100
File Size: 291374 KB
Manufacturer: SIEMENS [Siemens Semiconductor Group]
Download : Click here to Download
BSS 123 Maximum Ratings
| Parameter |
Symbol |
Value |
Unit |
| Drain source voltage |
VDS |
100 |
V |
| Drain-gate voltage RGS = 20 k |
VDGR |
100 |
V |
| Gate source voltage |
VGS |
± 14 |
V |
| Gate-source peak voltage,aperiodic |
Vgs |
± 20 |
V |
| Continuous drain current TA = 28 °C |
ID |
0.17 |
A |
| DC drain current, pulsed TA = 25 °C |
IDpuls |
0.68 |
A |
| Power dissipation TA = 25 °C |
Ptot |
0.36 |
W |
| Chip or operating temperature |
Tj |
-55 ... + 150 |
°C |
| Storage temperature |
Tstg |
-55 ... + 150 |
°C |
| Thermal resistance, chip to ambient air |
RthJA |
350 |
K/W |
| Thermal resistance, chip to ambient air 1) |
RthJA |
285 |
K/W |
| DIN humidity category, DIN 40 040 |
E |
||
| IEC climatic category, DIN IEC 68-1 |
55 / 150 / 56 |
BSS 123 Features
• N channel
• Enhancement mode
• Logic Level
• VGS(th) = 0.8...2.0V
• Enhancement mode
• Logic Level
• VGS(th) = 0.8...2.0V
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