BSP250, BSP250 T/R, BSP250T/R Selling Leads, Datasheet
MFG:Philips Package Cooled:Sot-223 D/C:09+
BSP250, BSP250 T/R, BSP250T/R Datasheet download
Part Number: BSP250
MFG: Philips
Package Cooled: Sot-223
D/C: 09+
MFG:Philips Package Cooled:Sot-223 D/C:09+
BSP250, BSP250 T/R, BSP250T/R Datasheet download
MFG: Philips
Package Cooled: Sot-223
D/C: 09+
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PDF/DataSheet Download
Datasheet: BSP250
File Size: 116986 KB
Manufacturer: PHILIPS [Philips Semiconductors]
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PDF/DataSheet Download
Datasheet: BSP030
File Size: 111955 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BSP030
File Size: 111955 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
MAX. |
UNIT |
VDS |
drain-source voltage |
-30 |
V | ||
VGSO |
gate-source voltage |
open drain |
±20 |
V | |
ID |
DC drain current |
Ts 100 °C |
-3 |
mA | |
IDM |
peak drain current |
note 1 |
-12 |
A | |
Ptot |
total power dissipation |
Ts = 100 °C |
5 |
W | |
Tamb = 25 °C; note 2 |
1.65 | ||||
Tstg |
storage temperature |
-65 |
+150 |
°C | |
Tj |
operating junction temperature |
150 |
°C |
Notes
1. Pulse width and duty cycle limited by maximum junction temperature.
2. Device mounted on an epoxy printed-circuit board, 40 X40 X1.5 mm; mounting pad for drain lead minimum 6 cm 2.