BSP225115, BSP230, BSP2313TV1.5 Selling Leads, Datasheet
MFG:NXP Package Cooled:SOT223 D/C:08+
BSP225115, BSP230, BSP2313TV1.5 Datasheet download
Part Number: BSP225115
MFG: NXP
Package Cooled: SOT223
D/C: 08+
MFG:NXP Package Cooled:SOT223 D/C:08+
BSP225115, BSP230, BSP2313TV1.5 Datasheet download
MFG: NXP
Package Cooled: SOT223
D/C: 08+
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PDF/DataSheet Download
Datasheet: BSP030
File Size: 111955 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BSP230
File Size: 97719 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BSP030
File Size: 111955 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
MAX. |
UNIT |
VDS |
drain-source voltage |
-300 |
V | ||
VGSO |
gate-source voltage |
open drain |
±20 |
V | |
ID |
DC drain current |
-210 |
mA | ||
IDM |
peak drain current |
-0.75 |
A | ||
Ptot |
total power dissipation |
up to Tamb = 25 °C; note 1 |
1.5 |
W | |
Tstg |
storage temperature |
-65 |
+150 |
°C | |
Tj |
operating junction temperature |
150 |
°C |
Note to the Limiting values and Thermal characteristics
1. Device mounted on an epoxy printed-circuit board, 40 x 40 x 1.5 mm; mounting pad for drain lead minimum 6 cm 2.
· Direct interface to C-MOS, TTL, etc.
· High-speed switching
· No secondary breakdown