BSP220, BSP223, BSP225 Selling Leads, Datasheet
MFG:PHILIPS Package Cooled:05+ D/C:10000
BSP220, BSP223, BSP225 Datasheet download
Part Number: BSP220
MFG: PHILIPS
Package Cooled: 05+
D/C: 10000
MFG:PHILIPS Package Cooled:05+ D/C:10000
BSP220, BSP223, BSP225 Datasheet download
MFG: PHILIPS
Package Cooled: 05+
D/C: 10000
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PDF/DataSheet Download
Datasheet: BSP220
File Size: 78369 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BSP223
File Size: 104220 KB
Manufacturer: SIEMENS [Siemens Semiconductor Group]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: BSP225
File Size: 78587 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
P-channel enhancement mode vertical D-MOS transistor in a miniature SOT223 envelope and intended for use in relay, high-speed and line transformer drivers.
SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
MAX. |
UNIT |
-VDS |
drain-source voltage |
200 |
V | ||
-VGSO |
gate-source voltage |
open drain |
20 |
V | |
-ID |
DC drain current |
DC value |
225 |
mA | |
-IDM |
peak drain current |
peak value |
600 |
A | |
Ptot |
total power dissipation |
up to Tamb = 25 °C (note 1) |
1.5 |
W | |
Tstg |
storage temperature |
-65 |
150 |
°C | |
Tj |
operating junction temperature |
150 |
°C |
Note
1. Device mounted on an epoxy printed-circuit board 40 x 40 x 1.5 mm; mounting pad for the drain lead minimum 6 cm2.
P-channel enhancement mode vertical D-MOS transistor in a miniature SOT223 envelope, intended for use in relay, high-speed and line transformer drivers.
SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
MAX. |
UNIT |
-VDS |
drain-source voltage |
250 |
V | ||
-VGSO |
gate-source voltage |
open drain |
20 |
V | |
-ID |
DC drain current |
DC value |
225 |
mA | |
-IDM |
peak drain current |
peak value |
600 |
A | |
Ptot |
total power dissipation |
up to Tamb = 25 °C (note 1) |
1.5 |
W | |
Tstg |
storage temperature |
-65 |
150 |
°C | |
Tj |
operating junction temperature |
150 |
°C |
Note
1. Device mounted on an epoxy printed-circuit board, 40 x 40 x 1.5 mm, mounting pad for the drain tab minimum 6 cm2.
· Low R DS(on)
· Direct interface to C-MOS, TTL, etc.
· High-speed switching
· No secondary breakdown