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Output power dissipation (per channel for dual channel)
Pdiss
25
mW
OUTPUT
Supply voltage
1 min maximum
VCC
7
V
Output current
IO
50
mA
Output voltage
VO
7
V
Output power dissipation (single channel)
Pdiss
85
mW
Output power dissipation (per channel for dual channel)
Pdiss
60
mW
COUPLER
Isolation test voltage
t = 1.0 s
VISO
4000
VRMS
Storage temperature
Tstg
- 55 to + 150
°C
Operating temperature
Tamb
- 40 to + 100
°C
Lead solder temperature
for 10 s
260
°C
Solder reflow temperature (2)
for 1 min
260
°C
Notes (1) Tamb = 25 °C, unless otherwise specified. Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute maximum ratings for extended periods of the time can adversely affect reliability. (2) Refer to reflow profile for soldering conditions for surface mounted devices.
VO0600T Features
• Choice of CMR performance of 15 kV/s, 5 kV/s, and 100 V/s • High speed: 10 MBd typical • + 5 V CMOS compatibility • Pure tin leads • Guaranteed AC and DC performance over temperature: - 40 °C to + 100 °C temp. range • Meets IEC 60068-2-42 (SO2) and IEC 60068-2-43 (H2S) requirements • Low input current capability: 5 mA • Lead (Pb)-free component • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
VO0600T Typical Application
• Microprocessor systemM interface • PLC, ATE input/output isolation • Computer peripheral interface: SPI • Digital fieldbus isolation: CC-Link, DeviceNet, profibus, SDS • High speed A/D and D/A conversion • AC plasma display panel level shifting • Multiplexed data transmission • Digital control power supply • Ground loop elimination