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TSEV8308500GL, TSEV8308500GLZA2, TSEV83102G0BGL

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MFG:Atmel  Package Cooled:N/A  D/C:09+

TSEV8308500GL, TSEV8308500GLZA2, TSEV83102G0BGL Picture

TSEV8308500GL, TSEV8308500GLZA2, TSEV83102G0BGL Datasheet download

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Part Number: TSEV8308500GL

 

MFG: Atmel

Package Cooled: N/A

D/C: 09+

 

 

 
 
 
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About TSEV8308500GL

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Datasheet: TSEV8308500GL

File Size: 503389 KB

Manufacturer: ATMEL [ATMEL Corporation]

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About TSEV8308500GLZA2

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Datasheet: TSEV8308500GLZA2

File Size: 503389 KB

Manufacturer: ATMEL [ATMEL Corporation]

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Datasheet: TSEV83102G0BGL

File Size: 1577456 KB

Manufacturer: ATMEL [ATMEL Corporation]

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TSEV8308500GL General Description

The TSEV8308500GL Evaluation Board (EB) is a prototype board which has beendesigned in order to facilitate the evaluation and the characterization of the
TS8308500GL device (in CBGA68) up to its 1.3 GHz full analog power bandwidth atup to 500 Msps in the extended temperature range.

The high speed sampling rate of the TS8308500GL requires careful attention to circuitdesign and layout to achieve optimal performance. This four metal layer board withinternal ground plane has the adequate functions in order to allow a quick and simpleevaluation of the TS8308500GL ADC performances over the temperature range.

The TS8308500GL Evaluation Board (EB) is very straightforward as it only imple-ments the TS8308500GL ADC device, SMA connectors for input/output accesses anda 2.54 mm pitch connector compatible with standard high frequency probes.

The board also implements a de-embedding fixture in order to facilitate the evaluationof the high frequency insertion loss of the inputs microstrip lines, and a die junctiontemperature measurement setting.

The board is constituted by a sandwich of two dielectriclayers, featuring low insertionloss and enhanced thermal characteristics for operation in the high frequency domainand extended temperature range.

The board dimensions are 130 mm x 130 mm.

The board set comes fully assembled and tested, with the TS8308500GL installedand heatsink.

TSEV8308500GL Maximum Ratings

Parameter

Symbol

Comments

Values

Unit

Positive supply voltage

VCC

 

GND to 6

V

Digital negative supply voltage

DVEE

 

GND to -5.7

V

Digital positive supply voltage

VPLUSD

 

GND -0.3 to 2.8

V

Negative supply voltage

VEE

 

VGND to -6

V

Maximum difference between negative supply voltage

DVEE to VEE

 

0.3

V

Analog input voltages

VIN or VINB

 

-1 to +1

V

Maximum difference between VIN and VINB

VIN - VINB

 

-2 to +2

V

Digital input voltage

VD

GORB

-0.3 to VCC +0.3

V

Digital input voltage

VD

DRRB

VEE
-0.3 to +0.9

V

Digital output voltage

VO

 

VPLUSD
-3 to VPLUSD
-0.5

V

Clock input voltage

VCLK or VCLKB

 

-3 to +1.5

V

Maximum junction temperature

VCLK - VCLKB

 

-2 to +2

V

Junction temperature

TJ

 

+145

°C

Storage temperature

Tstg

 

- 65to + 150

°C

Lead temperature (soldering 10s)

Tleads

 

+300

°C

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