TSEV8308500GL

The TSEV8308500GL Evaluation Board (EB) is a prototype board which has beendesigned in order to facilitate the evaluation and the characterization of the
TS8308500GL device (in CBGA68) up to its 1.3 GHz full analog power bandwidth atup to 500 Msps in the extended temperature range.

The high speed sampling rate of the TSEV8308500GL requires careful attention to circuitdesign and layout to achieve optimal performance. This four metal layer board withinternal ground plane has the adequate functions in order to allow a quick and simpleevaluation of the TSEV8308500GL ADC performances over the temperature range.

The TSEV8308500GL Evaluation Board (EB) is very straightforward as it only imple-ments the TSEV8308500GL ADC device, SMA connectors for input/output accesses anda 2.54 mm pitch connector compatible with standard high frequency probes.

The TSEV8308500GL also implements a de-embedding fixture in order to facilitate the evaluationof the high frequency insertion loss of the inputs microstrip lines, and a die junctiontemperature measurement setting.

The TSEV8308500GL is constituted by a sandwich of two dielectriclayers, featuring low insertionloss and enhanced thermal characteristics for operation in the high frequency domainand extended temperature range.

The TSEV8308500GL dimensions are 130 mm x 130 mm.

The TSEV8308500GL set comes fully assembled and tested, with the TS8308500GL installedand heatsink.