TLN113, TLN115A, TLN117 Selling Leads, Datasheet
MFG:TOSHIBA Package Cooled:3mm D/C:08+
TLN113, TLN115A, TLN117 Datasheet download
Part Number: TLN113
MFG: TOSHIBA
Package Cooled: 3mm
D/C: 08+
MFG:TOSHIBA Package Cooled:3mm D/C:08+
TLN113, TLN115A, TLN117 Datasheet download
MFG: TOSHIBA
Package Cooled: 3mm
D/C: 08+
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PDF/DataSheet Download
Datasheet: TLN113
File Size: 239428 KB
Manufacturer: TOSHIBA [Toshiba Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TLN115A
File Size: 212810 KB
Manufacturer: TOSHIBA [Toshiba Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TLN117
File Size: 187335 KB
Manufacturer: Toshiba
Download : Click here to Download
Characteristic |
Symbol |
Rating |
Unit |
Forward current |
IF |
50 |
mA |
Pulse forward current |
IFP |
600 (Note 1) |
mA |
Forward current derating (Ta > 25) |
IF/ |
−0.33 |
mA/ |
Reverse voltage |
VR |
5 |
V |
Operating temperature |
Topr |
−25~85 |
|
Storage temperature |
Tstg |
−40~100 |
|
Soldering temperature (5s) |
Tsol |
260 (Note 2) |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Note 1: Pulse width 100s, repetitive frequency =100Hz
Note 2: Soldering must be performed 2mm from the bottom of the package body.