SN74LVT241PW, SN74LVT244A, SN74LVT244ADBLE Selling Leads, Datasheet
MFG:TI Package Cooled:SMD D/C:96
SN74LVT241PW, SN74LVT244A, SN74LVT244ADBLE Datasheet download
Part Number: SN74LVT241PW
MFG: TI
Package Cooled: SMD
D/C: 96
MFG:TI Package Cooled:SMD D/C:96
SN74LVT241PW, SN74LVT244A, SN74LVT244ADBLE Datasheet download
MFG: TI
Package Cooled: SMD
D/C: 96
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PDF/DataSheet Download
Datasheet: SN7000
File Size: 81454 KB
Manufacturer: SIEMENS [Siemens Semiconductor Group]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: SN74LVT244A
File Size: 111451 KB
Manufacturer: TI [Texas Instruments]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: SN7000
File Size: 81454 KB
Manufacturer: SIEMENS [Siemens Semiconductor Group]
Download : Click here to Download
These octal buffers and line drivers are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.
The 4LVT244A is organized as two 4-bit line drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN74LVT244A is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN54LVT244A is characterized for operation over the full military temperature range of 55°C to 125°C.
The SN74LVT244A is characterized for operation from 40°C to 85°C.
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 4.6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V
Voltage range applied to any output in the high state or power-off state, VO (see Note 1) . . . 0.5 V to 7 V
Current into any output in the low state, IO: SN54LVT244A . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . 96 mA
SN74LVT244A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Current into any output in the high state, IO (see Note 2): SN54LVT244A . . . . . . . . . . . . . . . . . . .. . . . 48 mA
SN74LVT244A . . . . . . . . . . . . . . . . . . .. . . . 64 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
Maximum power dissipation at TA = 55°C (in still air) (see Note 3): DB package . . . . . . . . . . . . . .. . . . 0.6 W
DW package . . . . . . . . . . . . . . . . . . 1.6 W
PW package . . . . . . . . . . . . . . . . . . 0.7 W
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C
‡ Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This current will only flow when the output is in the high state and VO > VCC.
3. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils. For more information, refer to the Package Thermal Considerations application note.
• State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low-Static Power Dissipation
• Supports Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
• Supports Unregulated Battery Operation Down to 2.7 V
• Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
• Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
• Bus-Hold Data Inputs Eliminate the Need for External Pullup Resistors
• Supports Live Insertion
• Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), and Ceramic DIPs (J)