SN74HC645D, SN74HC652, SN74HC679N Selling Leads, Datasheet
MFG:TI Package Cooled:SOP D/C:1999
SN74HC645D, SN74HC652, SN74HC679N Datasheet download
Part Number: SN74HC645D
MFG: TI
Package Cooled: SOP
D/C: 1999
SN74HC645D, SN74HC652, SN74HC679N
- Table of contents:
Info of SN74HC645D
Info of SN74HC652
Info of SN74HC679N
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About SN7000
PDF/DataSheet Download
Datasheet: SN7000
File Size: 81454 KB
Manufacturer: SIEMENS [Siemens Semiconductor Group]
Download : Click here to Download
About SN74HC652
PDF/DataSheet Download
Datasheet: SN74HC652
File Size: 167415 KB
Manufacturer:
Download : Click here to Download
About SN7000
PDF/DataSheet Download
Datasheet: SN7000
File Size: 81454 KB
Manufacturer: SIEMENS [Siemens Semiconductor Group]
Download : Click here to Download
SN74HC652 General Description
These devices consist of bus-transceiver circuits, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the data bus or from the internal storage registers. Output-enable (OEAB and OEBA) inputs are provided to control the transceiver functions. Select-control (SAB and SBA) inputs are provided to select real-time or stored data transfer. A low input level selects real-time data, and a high input level selects stored data. Figure 1 illustrates the four fundamental bus-management functions that can be performed with the ’HC652.
Data on the A or B data bus, or both, can be stored in the internal D-type flip-flops by low-to-high transitions at the appropriate clock (CLKAB or CLKBA) terminals regardless of the select- or output-control terminals. When SAB and SBA are in the real-time transfer mode, it is possible to store data without using the internal D-type flip-flops by simultaneously enabling OEAB and OEBA. In this configuration, each output reinforces its input. When all other data sources to the two sets of bus lines are at high impedance, each set of bus lines remains at its last state.
The SN54HC652 is characterized for operation over the full military temperature range of –55°C to 125°C. The SN74HC652 is characterized for operation from –40°C to 85°C.
SN74HC652 Maximum Ratings
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . .±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . ..±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . .±35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±70 mA
Package thermal impedance, θJA (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . .81°C/W
NT package . . . . . . . . . . . . . . . . . . . . . . . . . .67°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. .–65°C to 150°C
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace length of zero.
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . .±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . ..±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . .±35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±70 mA
Package thermal impedance, θJA (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . .81°C/W
NT package . . . . . . . . . . . . . . . . . . . . . . . . . .67°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. .–65°C to 150°C
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace length of zero.
SN74HC652 Features
Independent Registers and Enables for A and B Buses
Multiplexed Real-Time and Stored Data
True Data Paths
High-Current 3-State Outputs Can Drive up to 15 LSTTL Loads
Package Options Include Plastic Small-Outline (DW) and Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (NT) and Ceramic (JT) 300-mil DIPs
Multiplexed Real-Time and Stored Data
True Data Paths
High-Current 3-State Outputs Can Drive up to 15 LSTTL Loads
Package Options Include Plastic Small-Outline (DW) and Ceramic Flat (W) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (NT) and Ceramic (JT) 300-mil DIPs
SN74HC652 Connection Diagram
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