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This 1-bit to 4-bit address driver is designed for 1.65-V to 3.6-V VCC operation.
The SN74ALVCH16344 is used in applications in which four separate memory locations must be addressed by a single address.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Active bus-hold circuitry is provided to hold unused or floating inputs at a valid logic level.
The SN74ALVCH16344 is characterized for operation from 40°C to 85°C.
*Member of the Texas Instruments Widebus™ Family *EPIC™ (Enhanced-Performance Implanted CMOS) Submicron Process *Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors *Latch-Up Performance Exceeds 250 mA Per JESD 17 *Package Options Include Plastic 300-mil Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages
SN74ALVCH16344 Connection Diagram
SN74ALVCH16373 General Description
This 16-bit transparent D-type latch is designed for 1.65-V to 3.6-V VCC operation.
The SN74ALVCH16373 is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. This device can be used as two 8-bit latches or one 16-bit latch. When the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the levels set up at the D inputs.
SN74ALVCH16373 Maximum Ratings
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 4.6 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . .. 0.5 V to 4.6 V Output voltage range, VO (see Notes 1 and 2) . .. 0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . .......... . . . 50 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . .... 50 mA Continuous output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Continuous current through each VCC or GND . . . . . . . . . . . .. . ±100 mA Package thermal impedance, JA (see Note 3): DGG package .. . . 89°C/W DL package . .. . .. 94°C/W Storage temperature range, Tstg 65. . . . . . . . . . . . . . . . . . . . C to 150 C
SN74ALVCH16373 Features
Member of the Texas Instruments Widebus(TM) Family EPIC (TM) (Enhanced-Performance Implanted CMOS) Submicron Process ESD Protection Exceeds 2000 V Per MIL-STD-833, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Latch-Up Performance Exceeds 250 mA Per JESD 17 Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages