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SN74ABT8245DWRE4, SN74ABT8245DWRG4, SN74ABT827

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Info of SN74ABT8245DWRE4
Info of SN74ABT8245DWRG4
Info of SN74ABT827

SN74ABT8245DWRE4, SN74ABT8245DWRG4, SN74ABT827 Selling Leads, Datasheet

MFG:Texas Instruments Category:Integrated Circuits (ICs) Package Cooled:SOIC24 D/C:2010+

SN74ABT8245DWRE4, SN74ABT8245DWRG4, SN74ABT827 Datasheet download

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Part Number: SN74ABT8245DWRE4

Category: Integrated Circuits (ICs)

MFG: Texas Instruments

Package Cooled: SOIC24

D/C: 2010+

Description: SN74ABT8245DWRG4

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SN74ABT8245DWRE4 Parameters

Technical/Catalog Information	SN74ABT8245DWRE4
Vendor	Texas Instruments
Category	Integrated Circuits (ICs)
Logic Type	Scan Test Device with Bus Transceivers
Mounting Type	Surface Mount
Package / Case	24-SOIC (7.5mm Width)
Supply Voltage	4.5 V ~ 5.5 V
Packaging	Tape & Reel (TR)
Operating Temperature	-40°C ~ 85°C
Drawing Number	296; 4040000-5; DW; 24
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	SN74ABT8245DWRE4 SN74ABT8245DWRE4

SN74ABT8245DWRG4 Parameters

Technical/Catalog Information	SN74ABT8245DWRG4
Vendor	Texas Instruments
Category	Integrated Circuits (ICs)
Logic Type	Scan Test Device with Bus Transceivers
Mounting Type	Surface Mount
Package / Case	24-SOIC (7.5mm Width)
Supply Voltage	4.5 V ~ 5.5 V
Packaging	Tape & Reel (TR)
Operating Temperature	-40°C ~ 85°C
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	SN74ABT8245DWRG4 SN74ABT8245DWRG4

SN74ABT827 General Description

These 10-bit buffers or bus drivers provide a high-performance bus interface for wide data paths or buses carrying parity.

The 3-state control gate is a 2-input AND gate with active-low inputs so that if either output-enable (OE1 or OE2) input is high, all ten outputs are in the high-impedance state. The 'ABT827 provide true data at the outputs.

When V_CC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABT827 is characterized for operation over the full military temperature range of 55°C to 125°C. The SN74ABT827 is characterized for operation from 40°C to 85°C.

SN74ABT827 Maximum Ratings

Supply voltage range, V_CC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 V to 7 V
Input voltage range, V_I(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . .. . .. . . . . . . . . . .0.5 V to 7 V
Voltage applied to any output in the high state or power-off state, V_O . . . . . . . . . .0.5 V to 5.5 V
Current into any output in the low state, I_O: SN54ABT827 . . . . . . . . . . . . .. . . . . . . . . . . . .. . .96 mA
                                                                       SN74ABT827 . . . . . . . . . . . . . . . . . . . . . . . .. .128 mA
Input clamp current, I_IK (V_I < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . .. .18 mA
Output clamp current, I_OK (V_O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50 mA
Package thermal impedance, _JA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . .104°C/W
                                                                          DW package . . . .. . . . . . . . . . . . . . . . . . . . .81°C/W
                                                                          NT package . . . .. . . . . . . . . . . . .. . . . . . . . . 67°C/W
                                                                          PW package . . . . . . . . . . . . . . . . . . . . . . .. .120°C/W
Storage temperature range, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .    . . .. . . .65°C to 150°C

SN74ABT827 Features

State-of-the-Art EPIC-II B^TM BiCMOS Design Significantly Reduces Power Dissipation
Flow-Through Architecture Optimizes PCB Layout
Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
Typical V_OLP (Output Ground Bounce) < 1 V at V_CC = 5 V, T_A = 25°C
High-Impedance State During Power Up and Power Down
High-Drive Outputs (32-mA I_OH, 64-mA I_OL)
Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), and Plastic (NT) and Ceramic (JT) DIPs

SN74ABT827 Connection Diagram

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