RFT3055, RFT3055LE, RFT3100 Selling Leads, Datasheet
MFG:Intersil Package Cooled:7850 D/C:02+
RFT3055, RFT3055LE, RFT3100 Datasheet download
Part Number: RFT3055
MFG: Intersil
Package Cooled: 7850
D/C: 02+
RFT3055, RFT3055LE, RFT3100
- Table of contents:
Info of RFT3055
Info of RFT3055LE
Info of RFT3100
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About RFT3055
PDF/DataSheet Download
Datasheet: RFT3055
File Size: 98422 KB
Manufacturer: INTERSIL [Intersil Corporation]
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About RFT3055LE
PDF/DataSheet Download
Datasheet: RFT3055LE
File Size: 98422 KB
Manufacturer: INTERSIL [Intersil Corporation]
Download : Click here to Download
About rft3100
PDF/DataSheet Download
Datasheet: rft3100
File Size: 144363 KB
Manufacturer:
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RFT3055LE Maximum Ratings
| RFW2N06RLE |
UNITS | |
| Drain to Source Breakdown Voltage (Note 1) . . . . VDS |
60 |
V |
| Package Body for 10s, See Techbrief 334 . . . . . . . . . .Tpkg | 60 | V |
| Drain to Gate Voltage (RGS = 20kW) (Note 1) . . . .VDGR | 2 | V |
| Continuous Drain Current . . . . . . . . . . . .ID | 14 | |
| Pulsed Drain Current (Note 3) . . . . . . IDM | -5 to 10 | A |
| Gate to Source Voltage . . . . . . . . . . . . VGS | 1.09 | |
| Maximum Power Dissipation (Figure 1). . . . . . . . . PD | 0.009 | |
| Linear Derating Factor (Figure 1. . . . . . . . | Refer to UIS | W |
| Single Pulse Avalanche Energy Rating . . . . . . . EAS | Curve |
mW/o C |
| Electrostatic Discharge Rating, MIL-STD-883, Catagory B(2) .ESD | 2 | o C |
| Operating and Storage Temperature . . . . . . . . . . . TJ, TSTG | -55 to 150 |
|
| Maximum Temperature for Soldering | 300 | o C |
| Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . TL | 260 | o C |
RFT3055LE Features
• 2.0A, 60V
• rDS(ON) = 0.150W
• 2kV ESD Protected
• Temperature Compensating PSPICE® Model
• Thermal Impedance SPICE Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Related Literature
- TB334, "Guidelines for Soldering Surface Mount Components to PC Boards"
• rDS(ON) = 0.150W
• 2kV ESD Protected
• Temperature Compensating PSPICE® Model
• Thermal Impedance SPICE Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Related Literature
- TB334, "Guidelines for Soldering Surface Mount Components to PC Boards"
RFT3100 General Description
The RFT3100 is a kind of baseband-to-radio frequency (RF) transmit processor. It performs all transmit (Tx) signal processing functions required between the analog baseband and the power amplifier (PA) for IS-95 code division multiple access (CDMA) cellular, JSTD-018 PCS, and ARIB-53 (Japan) single-band and dual-band applications.
The device incorporates the previous-generation functionality of the IF3000 baseband-to-intermediate frequency (IF) processor together with RF upconversion and driver amplifiers. The device is available in three configurations: dual-band cellular and PCS (RFT3100-1), cellular-only (RFT3100-2) and PCS-only (RFT3100-3). The device includes an IF micer for upconverting analog baseband to IF, a programmable phase locked loop (PLL) for generating Tx IF frequency, single-sideband upconversion from IF to RF, two celluar and two PCS driver amplifiers (dual-band version), and Tx power control through an 85 dB variable gain amplifier (VGA).
There are some features as follows: (1)full upconversion from analog baseband to RF; (2)integrated I/Q modulator, IF VCO/PLL, SSB upconverter, VGA and driver amplifiers; (3)designed for dual-mode cellular (CDMA/AMPS), single-band PCS, or dual-band PCS (PCS CDMA/AMPS) applications; (4)eliminates image-reject filter between upconverter and driver amplifier; (5)includes two cellular and two PCS driver amplifier outputs (dual-band version); (6)MSM-controlled operation via serial bus interface (SBI); (7)Tx power control through 85 dB dynamic range VGA; (8)puncture mode (gated Tx power) for extended talk-time performance; (9)simplified RF PCB design and shorter development cycle time; (10)supply voltage from 2.7 to 3.3 V; (11)BCC++ 32-pad plastic chip scale package.
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