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RFT2P03L

Features: • 2.1A, 30V• rDS(ON) = 0.150W• Temperature Compensating PSPICE® Model• Thermal Impedance SPICE Model• Peak Current vs Pulse Width Curve• UIS Rating Curve• Related Literature- TB334, Guidelines for Soldering Surface Mount Components to PC Boa...

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SeekIC No. : 004476700 Detail

RFT2P03L: Features: • 2.1A, 30V• rDS(ON) = 0.150W• Temperature Compensating PSPICE® Model• Thermal Impedance SPICE Model• Peak Current vs Pulse Width Curve• UIS Rating ...

RFT2P03L Data Sheet

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Part Number:
RFT2P03L
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/7

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Product Details

Description



Features:

• 2.1A, 30V
• rDS(ON) = 0.150W
• Temperature Compensating PSPICE® Model
• Thermal Impedance SPICE Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Related Literature
- TB334, "Guidelines for Soldering Surface Mount Components to PC Boards"


Specifications

UNITS
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS     - 30        V
Drain to Gate Voltage (RGS = 20kW) (Note 1) . . . . . . . . . . . . . . . . . . . . . . .  VDGR     -30         V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS     ±20V      V
Drain Current
Continuous (Note 2) (Figure 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .IDM    2.1Figure  5 A
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EAS  Figures 6, 14, 15
Power Dissipation (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  PD
Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1    0.009W  W/o C
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TJ, TSTG -55 to 150 o C
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . .TL     260         o C
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg 300        o C



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