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RFT1P06E, RFT2P03L, RFT2P03L136

Table of contents:
Info of RFT1P06E
Info of RFT2P03L
Info of RFT2P03L136

RFT1P06E, RFT2P03L, RFT2P03L136 Selling Leads, Datasheet

MFG:Intersil Package Cooled:7850 D/C:02+

RFT1P06E, RFT2P03L, RFT2P03L136 Datasheet download

Five Points

Part Number: RFT1P06E

MFG: Intersil

Package Cooled: 7850

D/C: 02+

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RFT1P06E Maximum Ratings

	RFW2N06RLE	UNITS
Drain to Source Breakdown Voltage (Note 1) . . . . VDS	-60	V
Drain to Gate Voltage (RGS = 20kW) (Note 1). . .VDGR	-60	V
Drain to Gate Voltage (RGS = 20kW) (Note 1) . . . .VDGR	±20V	V
Continuous Drain Current . . . . . . . . . . . .ID	1.4
Pulsed Drain Current (Note 3) . . . . . . IDM	-5 to 10	A
Gate to Source Voltage . . . . . . . . . . . . VGS	1.09
Maximum Power Dissipation (Figure 1). . . . . . . . . PD	0.009
Linear Derating Factor (Figure 1. . . . . . . .	Refer to UIS	W
Single Pulse Avalanche Energy Rating . . . . . . . EAS		mW/oC
Electrostatic Discharge Rating, MIL-STD-883, Catagory B(2) .ESD		oC
Operating and Storage Temperature . . . . . . . . . . . TJ, TSTG	-55 to 150
Maximum Temperature for Soldering	300	oC
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . TL	260	oC

RFT1P06E Features

• 1.4A, 60V
• rDS(ON) = 0.285W
• 2kV ESD Protected
• Temperature Compensating PSPICE® Model
• SPICE Thermal Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• 150oC Operating Temperature
• Related Literature
- TB334, "Guidelines for Soldering Surface Mount
Components to PC Boards"

RFT2P03L Maximum Ratings

UNITS
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS     - 30        V
Drain to Gate Voltage (RGS = 20kW) (Note 1) . . . . . . . . . . . . . . . . . . . . . . .  VDGR     -30         V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS     ±20V      V
Drain Current
Continuous (Note 2) (Figure 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .IDM    2.1Figure  5 A
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EAS  Figures 6, 14, 15
Power Dissipation (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  PD
Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1    0.009W  W/^o C
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TJ, TSTG -55 to 150 ^o C
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . .TL     260         ^o C
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg 300        ^o C

RFT2P03L Features

• 2.1A, 30V
• rDS(ON) = 0.150W
• Temperature Compensating PSPICE® Model
• Thermal Impedance SPICE Model
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Related Literature
- TB334, "Guidelines for Soldering Surface Mount Components to PC Boards"

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