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Lead Temperature for Soldering Purposes (1/8" from case for 10 s)
TL
250
°C
1. Surface mounted on FR4 board using 1 in sq. pad size (Cu area = 1.127 in sq. [1 oz] including traces).
NTJD4001N Features
• Low Gate Charge for Fast Switching • Small Footprint − 30% Smaller than TSOP−6 • ESD Protected Gate • Pb−Free Package for Green Manufacturing (G Suffix)