Features: • Leading Trench Technology for Low R DS(ON) Extending Battery Life• SC−88 Small Outline (2x2 mm, SC70−6 Equivalent)• Gate Diodes for ESD Protection• Pb−Free Package is Available Application• High Side Load Switch• Cell Phones, Compu...
NTJS3151P: Features: • Leading Trench Technology for Low R DS(ON) Extending Battery Life• SC−88 Small Outline (2x2 mm, SC70−6 Equivalent)• Gate Diodes for ESD Protection• Pb...
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Parameter |
Symbol |
Value |
Unit | ||
Drain−to−Source Voltage |
VDSS |
-12 |
V | ||
Gate−to−Source Voltage |
VGS |
±12 |
V | ||
Continuous Drain Current (Note 1) |
Steady State |
TJ = 25°C
TJ = 85°C |
ID |
−2.7 |
A |
−2.0 | |||||
t 5 s |
TJ = 25°C |
−3.3 | |||
Power Dissipation (Note 1) |
Steady
State |
PD |
0.625 |
W | |
Pulsed Drain Current |
tp = 10 s |
IDM |
−8.0 |
A | |
Operating Junction and Storage Temperature |
TJ , TSTG |
−55 to 150 |
°C | ||
Source Current (Body Diode) |
IS |
-0.8 |
A | ||
Lead Temperature for Soldering Purposes (1/8" from case for 10 s) |
TL |
260 |
°C |
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.