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NTD2955VT4, NTD3055, NTD3055-094

Table of contents:
Info of NTD2955VT4
Info of NTD3055
Info of NTD3055-094

NTD2955VT4, NTD3055, NTD3055-094 Selling Leads, Datasheet

MFG:ON Semiconductor Category:Discrete Semiconductor Products Package Cooled:TO-252 D/C:2005

NTD2955VT4, NTD3055, NTD3055-094 Datasheet download

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Part Number: NTD3055-094

Category: Discrete Semiconductor Products

MFG: ON Semiconductor

Package Cooled: TO-252

D/C: 2005

Description: MOSFET N-CH 60V 12A DPAK

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NTD3055-094 Parameters

Technical/Catalog Information	NTD3055-094
Vendor	ON Semiconductor
Category	Discrete Semiconductor Products
Mounting Type	Surface Mount
FET Polarity	N-Channel
Drain to Source Voltage (Vdss)	60V
Current - Continuous Drain (Id) @ 25° C	12A
Rds On (Max) @ Id, Vgs	94 mOhm @ 6A, 10V
Input Capacitance (Ciss) @ Vds	450pF @ 25V
Power - Max	1.5W
Packaging	Tube
Gate Charge (Qg) @ Vgs	20nC @ 10V
Package / Case	DPak, SC-63, TO-252 (2 leads+tab)
FET Feature	Standard
Drawing Number	*
Lead Free Status	Contains Lead
RoHS Status	RoHS Non-Compliant
Other Names	NTD3055 094 NTD3055094

NTD3055-094 General Description

Designed for low voltage, high speed switching applications in power supplies, converters and power motor controls and bridge circuits.

NTD3055-094 Maximum Ratings

Rating	Symbol	Value	Unit
Drain−to−Source Voltage	V_DSS	60	Vdc
Drain−to−Gate Voltage (R_GS = 10 M)	V_DGR	60	Vdc
Gate−to−Source Voltage − Continuous − Non−Repetitive (t_p10 ms)	V_GS V_GS	±20 ±30	Vdc
Drain Current − Continuous @ T_C= 25 − Continuous @ T_C = 100 − Single Pulse (t_p10 s)	I_D I_D I_DM	12 10 45	Adc Apk
Total Power Dissipation @ T_C= 25 Derate above 25 Total Power Dissipation @ T_C= 25 (Note 1) Total Power Dissipation @ T_C= 25 (Note 2)	P_D	48 0.32 2.1 1.5	W W/ W W
Operating and Storage Temperature Range	T_J, T_stg	−55 to +175
Single Pulse Drain−to−Source Avalanche Energy − Starting T_J= 25 (V_DD = 25 Vdc, V_GS = 10 Vdc, L = 1.0 mH I_L(pk) = 11 A, V_DS = 60 Vdc)	E_AS	61	mJ
Thermal Resistance − Junction−to−Case − Junction−to−Ambient (Note 1) − Junction−to−Ambient (Note 2)	R_JC R_JA R_JA	3.13 71.4 100	/W
Maximum Lead Temperature for Soldering Purposes, 1/8" from case for 10 seconds	T_L	260

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.

1. When surface mounted to an FR4 board using 0.5 sq in. pad size.
2. When surface mounted to an FR4 board using the minimum recommended pad size

NTD3055-094 Features

• Pb−Free Packages are Available
• Lower R_DS(on)• Lower V_DS(on)• Lower and Tighter V_SD
• Lower Diode Reverse Recovery Time
• Lower Reverse Recovery Stored Charge

NTD3055-094 Typical Application

• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits

NTD3055-094 Connection Diagram

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