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NTD14N03R

MOSFET 25V 14A N-Channel

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SeekIC No. : 00166891 Detail

NTD14N03R: MOSFET 25V 14A N-Channel

NTD14N03R Data Sheet

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Part Number:
NTD14N03R
Mfg:
ON Semiconductor
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 25 V
Gate-Source Breakdown Voltage : +/- 20 V Continuous Drain Current : 14 A
Resistance Drain-Source RDS (on) : 95 mOhms Configuration : Single
Maximum Operating Temperature : + 150 C Mounting Style : SMD/SMT
Package / Case : DPAK Packaging : Tube    

Description

Transistor Polarity : N-Channel
Drain-Source Breakdown Voltage : 25 V
Gate-Source Breakdown Voltage : +/- 20 V
Configuration : Single
Mounting Style : SMD/SMT
Package / Case : DPAK
Maximum Operating Temperature : + 150 C
Packaging : Tube
Continuous Drain Current : 14 A
Resistance Drain-Source RDS (on) : 95 mOhms


Features:

• Planar HD3e Process for Fast Switching Performance
• Low RDS(on) to Minimize Conduction Loss
• Low Ciss to Minimize Driver Loss
• Low Gate Charge
• Optimized for High Side Switching Requirements in
   High−Efficiency DC−DC Converters


Pinout

Connection Diagram


Specifications

Parameter

 Symbol Value Unit
Drain−to−Source Voltage VDSS 25 Vdc
Gate−to−Source Voltage − Continuous VGS ±20 Vdc
Thermal Resistance − Junction−to−Case
Total Power Dissipation @ TA = 25°C
Drain Current − Continuous @ TA = 25°C, Chip
− Continuous @ TA = 25°C, Limited by Package
− Single Pulse (tp < 10 s)		 RJA
PD
ID
ID
ID		 6.0
20.8
14
11.4
28		 °C/W
W
A
A
A
Thermal Resistance − Junction−to−Ambient
(Note 1)
Total Power Dissipation @ TA = 25°C
Drain Current − Continuous @ TA = 25°C		 RJA

PD
ID		 80

1.56
3.1		 °C/W

W
A
Thermal Resistance − Junction−to−Ambient
(Note 2)
Total Power Dissipation @ TA = 25°C
Drain Current − Continuous @ TA = 25°		 RJA

PD
ID		 120

1.04
2.5		 °C/W

W
A
Operating and Storage Temperature Range TJ, Tstg −55 to
150		 °C
Maximum Lead Temperature for Soldering
Purposes, 1/8, from case for 10 second		 TL 260 °C
1. When surface mounted to an FR4 board using 0.5 sq. in pad size.
2. When surface mounted to an FR4 board using minimum recommended pad size


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