MSA100U43, MSA-1023, MSA108AS Selling Leads, Datasheet
MFG:TOSHIBA Package Cooled:Module D/C:N/A
MSA100U43, MSA-1023, MSA108AS Datasheet download
Part Number: MSA100U43
MFG: TOSHIBA
Package Cooled: Module
D/C: N/A
MFG:TOSHIBA Package Cooled:Module D/C:N/A
MSA100U43, MSA-1023, MSA108AS Datasheet download
MFG: TOSHIBA
Package Cooled: Module
D/C: N/A
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PDF/DataSheet Download
Datasheet: MSA002
File Size: 537342 KB
Manufacturer: ETC [ETC]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: MSA-1023
File Size: 57507 KB
Manufacturer: HP [Agilent(Hewlett-Packard)]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: MSA002
File Size: 537342 KB
Manufacturer: ETC [ETC]
Download : Click here to Download
The MSA-1023 is a high performance, medium power silicon bipolar Monolithic Microwave Integrated Circuit (MMIC) housed in a hermetic, BeO flange package for good thermal characteristics.
This MMIC is designed for use in a push-pull configuration in a 25 system. The MSA-1023 can also be used as a single-ended amplifier in a 50 system with slightly reduced performance. Typical applications include narrow and broadband RF amplifiers in industrial and military systems.
The MSA-series is fabricated using HP's 10 GHz fT, 25 GHz f MAX, silicon bipolar MMIC process which uses nitride self-alignment, ion implantation, and gold metallization to achieve excellent performance, uniformity and reliability. The use of an external bias resistor for temperature and current stability also allows bias flexibility.
Parameter | Absolute Maximum[1] |
Device Current | 425 mA |
Power Dissipation[2,3] | 7.0W |
RF Input Power | +25 dBm |
Junction Temperature | 200 |
Storage Temperature | 65 to 200 |