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MMSZ5259B 7 F MMSZ5259B7F MMSZ5259B FDIDKR ND MMSZ5259BFDIDKRND MMSZ5259B-FDIDKR
MMSZ5259BS Maximum Ratings
Characteristic
Symbol
Value
Unit
Forward Voltage (Note 2) @ IF = 10mA
VF
0.9
V
Power Dissipation (Note 1)
Pd
200
mW
Thermal Resistance, Junction to Ambient Air (Note 1)
RJA
625
°C/W
Operating and Storage Temperature Range
Tj, TSTG
-65 to +150
°C
Notes: 1. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 2. Short duration pulse test used to minimize self-heating effect. 3. No purposefully added lead.
MMSZ5259BS Features
· Planar Die Construction · Ultra-Small Surface Mount Package · General Purpose · Ideally suited for Automated Assembly Processes · Lead Free /RoHS Compliant (Note 3)