K9W3M, K9W8G08U1M, K9W8G08U1M-PCB0 Selling Leads, Datasheet
MFG:NO Package Cooled:-6 D/C:NO
K9W3M, K9W8G08U1M, K9W8G08U1M-PCB0 Datasheet download
Part Number: K9W3M
MFG: NO
Package Cooled: -6
D/C: NO
MFG:NO Package Cooled:-6 D/C:NO
K9W3M, K9W8G08U1M, K9W8G08U1M-PCB0 Datasheet download
MFG: NO
Package Cooled: -6
D/C: NO
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PDF/DataSheet Download
Datasheet: K9WAG08U1A
File Size: 1290952 KB
Manufacturer: Samsung semiconductor
Download : Click here to Download
PDF/DataSheet Download
Datasheet: K9WAG08U1A
File Size: 1290952 KB
Manufacturer: Samsung semiconductor
Download : Click here to Download
PDF/DataSheet Download
Datasheet: K9WAG08U1A
File Size: 1290952 KB
Manufacturer: Samsung semiconductor
Download : Click here to Download
Offered in 512Mx8bit or 256Mx16bit, the K9XXGXXXXM is 4G bit with spare 128M bit capacity. Its NAND cell provides the most cost-effective solution for the solid state mass storage market. A program operation can be performed in typical 300ms on the 2112- byte(X8 device) or 1056-word(X16 device) page and an erase operation can be performed in typical 2ms on a 128K-byte(X8 device) or 64K-word(X16 device) block. Data in the data page can be read out at 50ns cycle time per byte(30ns, only X8 3.3v device) or word(X16 device). The I/O pins serve as the ports for address and data input/output as well as command input. The on-chip write controller automates all program and erase functions including pulse repetition, where required, and internal verification and margining of data. Even the write-intensive systems can take advantage of the K9XXGXXXXM¢s extended reliability of 100K program/erase cycles by providing ECC(Error Correcting Code) with real time mapping-out algorithm. The K9XXGXXXXM is an optimum solution for large nonvolatile storage applications such as solid state file storage and other portable applications requiring non-volatility. An ultra high density solution having two 4Gb stacked with two chip selects is also available in standard TSOPI package.
Parameter | Symbol |
Rating |
Unit | ||
K9K4GXXQ0M(1.8V) |
K9XXGXXUXM(3.3V) | ||||
Voltage on any pin relative to VSS | VIN/OUT |
-0.6 to + 2.45 |
-0.6 to + 4.6 |
V | |
VCC |
-0.2 to + 2.45 |
-0.6 to + 4.6 | |||
Temperature Under Bias | K9XXGXXUXM-XCB0 | TBIAS |
-10 to +125 |
||
K9XXGXXUXM-XIB0 |
-40 to +125 | ||||
Storage Temperature | K9K2G08U0A-VCB0 | TSTG |
-65 to +150 |
||
K9XXGXXUXM-XCB0 | |||||
Short Circuit Current | IOS |
5 |
mA |