IXFE50N50, IXFE55N50, IXFE73N30Q
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IXFE50N50 Features
•Low cost direct-copper bonded aluminium package •Encapsulating epoxy meets UL 94 V-0, flammability classification •2500V isolation •Low drain to case capacitance •Low RDS (on) HDMOSTM process •Rugged polysilicon gate cell structure •Unclamped Inductive Switching (UIS) rated •Low package inductance •Fast intrinsic Rectifier •Conforms to SOT-227B outline
IXFE50N50 Typical Application
• DC-DC converters • Battery chargers • Switched-mode and resonant-mode power supplies • DC choppers • Temperature and lighting controls
IXFE55N50 Features
•Low cost direct-copper bonded aluminium package •Encapsulating epoxy meets UL 94 V-0, flammability classification •2500V isolation •Low drain to case capacitance •Low RDS (on) HDMOSTM process •Rugged polysilicon gate cell structure •Unclamped Inductive Switching (UIS) rated •Low package inductance •Fast intrinsic Rectifier •Conforms to SOT-227B outline
IXFE55N50 Typical Application
• DC-DC converters • Battery chargers • Switched-mode and resonant-mode power supplies • DC choppers • Temperature and lighting controls
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