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Drain to Source Voltage (Note 1) .......................... VDSS 60 V Drain to Gate Voltage (RGS = 20k) (Note 1) .................... VDGR 60 V Gate to Source Voltage ............................... VGS ±20 V Drain Current Continuous(TC= 25, VGS= 5V)(Figure 2) .......................ID3.5 A Continuous (TA = 25, VGS = 10V) (Figure 2) (Note 2)................. ID3.8 A Continuous (TC= 100, VGS= 5V) (Figure 3) ......................ID1.0A Continuous (TA = 100, VGS = 4.5V) (Figure 2) (Note 3) ................ ID1.0A Pulsed Drain Current................................IDM Figure 4 Pulsed Avalanche Rating...........................ULS Figure6,17,18 Power Dissipation ...................................PD2.5W Derate Above 25 ..................................20 W/ Operating and Storage Temperature...................TJ, TSTG -55 to 175 Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s ......................TL 300 Package Body for 10s, See Techbrief 334 ......................Tpkg 260 NOTE: 1. TJ = 25 to 125 2. 50/W measured using FR-4 board with 0.76 in2 (490.3 mm2) copper pad at 1 second. 3. 228/W measured using FR-4 board with 0.006 in2 (3.87 mm2) copper pad at 1000 seconds. CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. .
HUFA76407DK8 Features
• Ultra Low On-Resistance - rDS(ON) = 0.090, VGS = 10V - rDS(ON) = 0.105, VGS = 5V • Simulation Models - Temperature Compensated PSPICE® and SABER™ Electrical Models - SPICE and SABER Thermal Impedance Models - www.fairchildsemi.com • Peak Current vs Pulse Width Curve • UIS Rating Curve • Transient Thermal Impedance Curve vs Board Mounting Area • Switching Time vs RGS Curves