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HUFA75831SK8 UNITS Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . VDSS 150 V Drain to Gate Voltage (RGS = 20k) (Note 1) . . . . . VDGR 150 V Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . VGS ±20 V Drain Current Continuous (TA = 25, VGS = 10V) (Figure 2) . . . . . . .ID 3 A Continuous (TA = 100, VGS = 10V) (Figure 2) . . . . . ID 2 A Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . ... IDM Figure 4 Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . .. . . . UIS Figures 6, 14, 15 Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD Derate Above 25 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5 W 20 mW/ Operating and Storage Temperature . . . . . . . . . . TJ, TSTG -55 to 150 Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s. . . . . . .... . TL 300 Package Body for 10s, See Tech Brief TB370 . . . . . .. . Tpkg 260
NOTES: 1. TJ = 25 to 125. 2. 50/W measured using FR-4 board with 0.76 in2 (490.3 mm2) copper pad at 10 second. 3. 152/W measured using FR-4 board with 0.054 in2 (34.8 mm2) copper pad at 1000 seconds 4. 189/W measured using FR-4 board with 0.0115 in2 (7.42 mm2) copper pad at 1000 seconds CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
HUFA75831SK8 Features
• Ultra Low On-Resistance - rDS(ON) = 0.095, VGS = 10V • Simulation Models - Temperature Compensated PSPICE® and SABER™ Electrical Models - Spice and SABER Thermal Impedance Models - www.fairchildsemi.com • Peak Current vs Pulse Width Curve • UIS Rating Curve