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rain Current Continuous(TC= 25, VGS = 10V) (Figure 2).
ID
75
A
rain Current Continuous(TC= 100, VGS = 10V) (Figure 2).
ID
73
A
Drain Current Pulsed Drain Current
IDM
Figure 4
Pulsed Avalanche Rating
EAS
Figures 6
Power Dissipation
PD
270
W
Derate Above 25
1.8
W/
Operating and Storage Temperature
TJ,TSTG
-55 to 175
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s.
TL
300
Package Body for 10s, See Techbrief 334
Tpkg
260
NOTES: 1. TJ = 25 to 150. CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
HUF75545S3 Features
• Ultra Low On-Resistance - rDS(ON) = 0.010, VGS = 10V • Simulation Models - Temperature Compensated PSPICE® and SABER™ Electrical Models - Spice and SABER Thermal Impedance Models - www.fairchildsemi.com • Peak Current vs Pulse Width Curve • UIS Rating Curve
HUF75545S3S Parameters
Technical/Catalog Information
HUF75545S3S
Vendor
Fairchild Semiconductor
Category
Discrete Semiconductor Products
Mounting Type
Surface Mount
FET Polarity
N-Channel
Drain to Source Voltage (Vdss)
80V
Current - Continuous Drain (Id) @ 25° C
75A
Rds On (Max) @ Id, Vgs
10 mOhm @ 75A, 10V
Input Capacitance (Ciss) @ Vds
3750pF @ 25V
Power - Max
270W
Packaging
Tube
Gate Charge (Qg) @ Vgs
235nC @ 20V
Package / Case
D²Pak, SMD-220, TO-263 (2 leads + tab)
FET Feature
Logic Level Gate
Lead Free Status
Lead Free
RoHS Status
RoHS Compliant
Other Names
HUF75545S3S HUF75545S3S
HUF75545S3S Maximum Ratings
HUF75545P3, HUF75545S3S
UNITS
Drain to Source Voltage (Note 1)
VDSS
80
V
Drain to Gate Voltage (RGS = 20k) (Note 1)
VDGR
80
V
Gate to Source Voltage
VGS
±20
V
rain Current Continuous(TC= 25, VGS = 10V) (Figure 2).
ID
75
A
rain Current Continuous(TC= 100, VGS = 10V) (Figure 2).
ID
73
A
Drain Current Pulsed Drain Current
IDM
Figure 4
Pulsed Avalanche Rating
EAS
Figures 6, 14, 15
Power Dissipation
PD
270
W
Derate Above 25
1.8
W/
Operating and Storage Temperature
TJ,TSTG
-55 to 175
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s.
TL
300
Package Body for 10s, See Techbrief 334
Tpkg
260
NOTES: 1. TJ = 25 to 150. CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.