HF4053BE, HF40A060ACB, HF40A060ACE Selling Leads, Datasheet
MFG:ST Package Cooled:2 D/C:100
HF4053BE, HF40A060ACB, HF40A060ACE Datasheet download
Part Number: HF4053BE
MFG: ST
Package Cooled: 2
D/C: 100
MFG:ST Package Cooled:2 D/C:100
HF4053BE, HF40A060ACB, HF40A060ACE Datasheet download
MFG: ST
Package Cooled: 2
D/C: 100
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Datasheet: HF40A060ACE
File Size: 16007 KB
Manufacturer:
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PDF/DataSheet Download
Datasheet: HF40A060ACE
File Size: 16007 KB
Manufacturer:
Download : Click here to Download
PDF/DataSheet Download
Datasheet: HF40A060ACE
File Size: 16007 KB
Manufacturer:
Download : Click here to Download
The HF40A060ACE has some electrical characteristics (wafer form).When parameter is VFM,the description is forward voltage,the guaranteed (Min/Max) is 1.6V Max.,the test conditions is TJ = 25,IF = 10A.When parameter is BVR,the description is reverse breakdown voltage,the guaranteed (Min/Max) is 600V Min.,the test conditions is TJ = 25,IR = 200A.When parameter is IRM,the description is reverse leakage current,the guaranteed (Min/Max) is 20A Max.,the test conditions is TJ = 25,VR = 600V.
The HF40A060ACE has some mechanical data.The nominal back metal composition,thickness is Cr-Ni-Ag(1 KA - 4 KA - 6 KA).The nominal front metal composition,thickness is 99% Al,1% Si (3 microns).The chip dimensions is 0.169" x 0.220" .The wafer diameter is 125mm,with std.< 100 > flat.The wafer thickness is .015" ± .003".The relevant die mechanical dwg. number is 01-5169.The minimum street width is 100 microns.The reject ink dot size is 0.25 mm diameter minimum.The recommended storage environment is storage in original container, in dessicated nitrogen, with no contamination.
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