FX602P, FX603, FX6031DW Selling Leads, Datasheet
MFG:CML Package Cooled:DIP D/C:2007
FX602P, FX603, FX6031DW Datasheet download
Part Number: FX602P
MFG: CML
Package Cooled: DIP
D/C: 2007
FX602P, FX603, FX6031DW
- Table of contents:
Info of FX602P
Info of FX603
Info of FX6031DW
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About FX601
PDF/DataSheet Download
Datasheet: FX601
File Size: 131565 KB
Manufacturer: SANYO [Sanyo Semicon Device]
Download : Click here to Download
About FX603
PDF/DataSheet Download
Datasheet: FX603
File Size: 110651 KB
Manufacturer: SANYO [Sanyo Semicon Device]
Download : Click here to Download
About FX601
PDF/DataSheet Download
Datasheet: FX601
File Size: 131565 KB
Manufacturer: SANYO [Sanyo Semicon Device]
Download : Click here to Download
FX603 Maximum Ratings
|
Parameter |
Symbol | Conditions | Ratings | Unit |
| Drain-to-Source Voltage | VDSS | -30 | V | |
| Gate-to-Source Voltage | VGSS | ±20 | V | |
| Drain Current (DC) | ID | -1 | A | |
| Drain Current (Pulse) | IDP | PW10s, duty cycle1% | -4 | A |
| Allowable Power Dissipation | PD | Tc=25°C 1 unit | 6 | W |
| PD | Mounted on ceramic board (750mm2*0.8mm) 1 unit | 1.5 | W | |
| Total Dissipation |
PT |
Mounted on ceramic board (750mm2*0.8mm) |
2 |
W |
| Channel Temperature | Tch | 150 | ||
| Storage Temperature | Tstg | 55 to +150 |
FX603 Features
· Composite type composed of two low ON-resistance P-channel MOSFET chips for ultrahigh-speed switching and low-voltage drive.
· Facilitates high-density mounting.
· The FX603 is formed with two chips, each being equivalent to the 2SJ187, placed in one package.
· Matched pair characteristics.
FX603 Connection Diagram
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