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This N-Channel MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers. It has been optimized for low gate charge, low rDS(on) and fast switching speed.
FDD8796 Maximum Ratings
Symbol
Parameter
Ratings
Units
VDS
Drain to Source Voltage
25
V
VGS
Gate to Source Voltage
±20
V
ID
Drain Current -Continuous (Package Limited)
35
A
-Continuous (Die Limited)
98
-Pulsed 1
305
EAS
Single Pulse Avalanche Energy 2
91
mJ
PD
Power Dissipation
88
W
TJ,TSTG
Operating and Storage Temperature
-55 to 175
°C
FDD8796 Features
` Max rDS(on) = 5.7m at VGS = 10V, ID = 35A ` Max rDS(on) = 8.0m at VGS = 4.5V, ID = 35A ` Low gate charge: Qg(10) = 37nC(Typ), VGS = 10V ` Low gate resistance ` Avalanche rated and 100% tested ` RoHS Compliant
FDD8796 Typical Application
· Vcore DC-DC for Desktop Computers and Servers · VRM for Intermediate Bus Architecture
FDD8870 Parameters
Technical/Catalog Information
FDD8870
Vendor
Fairchild Semiconductor
Category
Discrete Semiconductor Products
Mounting Type
Surface Mount
FET Polarity
N-Channel
Drain to Source Voltage (Vdss)
30V
Current - Continuous Drain (Id) @ 25° C
160A
Rds On (Max) @ Id, Vgs
3.9 mOhm @ 35A, 10V
Input Capacitance (Ciss) @ Vds
5160pF @ 15V
Power - Max
160W
Packaging
Tape & Reel (TR)
Gate Charge (Qg) @ Vgs
118nC @ 10V
Package / Case
DPak, SC-63, TO-252 (2 leads+tab)
FET Feature
Standard
Lead Free Status
Lead Free
RoHS Status
RoHS Compliant
Other Names
FDD8870 FDD8870
FDD8870 General Description
This N-Channel MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers. It has been optimized for low gate charge, low rDS(ON) and fast switching speed.
FDD8870 Maximum Ratings
Symbol
Parameter
Ratings
Units
VDSS VGSS
Drain-Source Voltage Gate-Source Voltage
30 ±20
160 150 21 Figure 4 690 160 1.07 -55 to 175
V V
A A A A mJ W W/°C °C
ID
Drain Current Continuous (TC = 25°C, V GS = 10V) (Note 1) Continuous (TC = 25°C, V GS = 4.5V) (Note 1) Continuous (Tamb = 25°C, VGS = 10V, with RqJA = 52°C/W) Pulsed
EAS
Single Pulse Avalanche Energy (Note 1)
PD
Power dissipation Derate above 25°C
TJ,TSTG
Operating and Storage Temperature
THERMAL CHARACTERISTICS
RJC RJA RJA
Thermal Resistance Junction to Case TO-252 Thermal Resistance Junction to Ambient TO-252 Thermal Resistance Junction to Ambient TO-252, 1in2 copper pad area
0.94 100 52
°C/W °C/W °C/W
FDD8870 Features
• rDS(ON) = 3.9mW, VGS = 10V, ID = 35A • rDS(ON) = 4.4mW, VGS = 4.5V, ID = 35A • High performance trench technology for extremely low rDS(ON) • Low gate charge • High power and current handling capability
FDD8874 Parameters
Technical/Catalog Information
FDD8874
Vendor
Fairchild Semiconductor
Category
Discrete Semiconductor Products
Mounting Type
Surface Mount
FET Polarity
N-Channel
Drain to Source Voltage (Vdss)
30V
Current - Continuous Drain (Id) @ 25° C
116A
Rds On (Max) @ Id, Vgs
5.1 mOhm @ 35A, 10V
Input Capacitance (Ciss) @ Vds
2990pF @ 15V
Power - Max
110W
Packaging
Tape & Reel (TR)
Gate Charge (Qg) @ Vgs
72nC @ 10V
Package / Case
DPak, SC-63, TO-252 (2 leads+tab)
FET Feature
Standard
Lead Free Status
Lead Free
RoHS Status
RoHS Compliant
Other Names
FDD8874 FDD8874
FDD8874 General Description
This N-Channel MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers. It has been optimized for low gate charge, low rDS(ON) and fast switching speed.
FDD8874 Maximum Ratings
Symbol
Parameter
Ratings
Units
VDSS VGSS
Drain-Source Voltage Gate-Source Voltage
30 ±20
116 103 18 Figure 4 240 110 0.73 -55 to 175
V V
A A A A A mJ W W/°C °C
ID
Drain Current Continuous (TC = 25°C, V GS = 10V) (Note 1) Continuous (TC = 25°C, V GS = 4.5V) (Note 1) Continuous (Tamb = 25°C, VGS = 10V, with RqJA = 52°C/W) Pulsed
EAS
Single Pulse Avalanche Energy (Note 2)
PD
Power dissipation Derate above 25°C
TJ,TSTG
Operating and Storage Temperature
THERMAL CHARACTERISTICS
RJC RJA RJA
Thermal Resistance Junction to Case TO-252 Thermal Resistance Junction to Ambient TO-252 Thermal Resistance Junction to Ambient TO-252, 1in2 copper pad area
1.36 100 52
°C/W °C/W °C/W
FDD8874 Features
• rDS(ON)= 5.1mW, VGS = 10V, ID = 35A • rDS(ON) = 6.4mW, VGS = 4.5V, ID = 35A • High performance trench technology for extremely low rDS(ON) • Low gate charge • High power and current handling capability