6516S, 6517, 6-517010-0 Selling Leads, Datasheet
MFG:Panasonic Package Cooled:SOP14S D/C:09+
6516S, 6517, 6-517010-0 Datasheet download
Part Number: 6516S
MFG: Panasonic
Package Cooled: SOP14S
D/C: 09+
MFG:Panasonic Package Cooled:SOP14S D/C:09+
6516S, 6517, 6-517010-0 Datasheet download
MFG: Panasonic
Package Cooled: SOP14S
D/C: 09+
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The Galvantech Synchronous Burst SRAM family mploys high-speed, low power CMOS designs using dvanced triple-layer polysilicon, double-layer metal echnology. Each memory cell consists of four transistors and wo high valued resistors.
The GVT71256E18 SRAM integrates 262,144x18 RAM cells with advanced synchronous peripheral circuitry nd a 2-bit counter for internal burst operation. All ynchronous inputs are gated by registers controlled by a ositive-edge-triggered clock input (CLK). The synchronous nputs include all addresses, all data inputs, address-pipelining hip enable (CE#), depth-expansion chip enables (CE2# and E2), burst control inputs (ADSC#, ADSP#, and ADV#), rite enables (WEL#, WEH#, and BWE#), and global write GW#).
Asynchronous inputs include the output enable (OE#), urst mode control (MODE), and sleep mode control (ZZ). The data outputs (DQ), enabled by OE#, are also asynchronous.
Addresses and chip enables are registered with either address status processor (ADSP#) or address status controller (ADSC#) input pins. Subsequent burst addresses can be internally generated as controlled by the burst advance pin (ADV#).
Address, data inputs, and write controls are registered onchip to initiate self-timed WRITE cycle. WRITE cycles can be one or two bytes wide as controlled by the write control inputs. Individual byte enables allow individual bytes to be written. WEL# controls DQ1-DQ8 and DQP1. WEH# controls DQ9-DQ16 and DQP2. WEL# and WEH# can be active only with BWE# being LOW. GW# being LOW causes all bytes to be written.
The GVT71256E18 operates from a +3.3V core power supply and all outputs operate on a +2.5V supply. All inputs and outputs are JEDEC standard JESD8-5 compatible. The device is ideally suited for 486, PentiumTM, 680x0, and PowerPCTM systems and for systems that are benefited from a wide synchronous data bus.
Voltage on VCC Supply Relative to VSS.. -0.5V to +4.6V
VIN ........................................................-0.5V to VCC+0.5V
Storage Temperature (plastic) ...................-55oC to +125o
Junction Temperature ...............................................+125o
Power Dissipation .......................................................1.4W
Short Circuit Output Current .....................................100mA
*Stresses greater than those listed under "Absolute Maximum atings" may cause permanent damage to the device.This is a stress ating only and functional operation of the device at these or any ther conditions above those indicated in the operational sections of his specification is not implied. Exposure to absolute maximum ating conditions for extended periods may affect reliability.