TPCS8210

Features: • Small footprint due to small and thin package• Low drain-source ON resistance: RDS (ON) = 19 m (typ.)• High forward transfer admittance: |Yfs| = 9.2 S (typ.)• Low leakage current: IDSS = 10 A (max) (VDS = 20 V)• Enhancement mode: Vth = 0.5~1.2 V (VDS = 10 ...

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SeekIC No. : 004526251 Detail

TPCS8210: Features: • Small footprint due to small and thin package• Low drain-source ON resistance: RDS (ON) = 19 m (typ.)• High forward transfer admittance: |Yfs| = 9.2 S (typ.)• Low...

floor Price/Ceiling Price

Part Number:
TPCS8210
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/11

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Product Details

Description



Features:

• Small footprint due to small and thin package
• Low drain-source ON resistance: RDS (ON) = 19 m (typ.)
• High forward transfer admittance: |Yfs| = 9.2 S (typ.)
• Low leakage current: IDSS = 10 A (max) (VDS = 20 V)
• Enhancement mode: Vth = 0.5~1.2 V (VDS = 10 V, ID = 200 A)
• Common drain



Specifications

Characteristic Symbol Rating Unit
Drain-source voltage VDSS 20 V
Drain-gate voltage (RGS=20 k) VDGR 20 V
Gate-source voltage VGSS ±12 V
Drain current DC (Note 1) ID 5 A
Pulsed (Note 1) IDP 20
Power dissipation (t= 10 s) (Note 2a) Single-device operation (Note 3a) PD(1) 1.1 W
Single-device value at
dual operation (Note 3b)
PD(2) 0.75
Power dissipation (t= 10 s) (Note 2b) Single-device operation (Note 3a) PD(1) 0.6
Single-device value at
dual operation (Note 3b)
PD(2) 0.35
Single pulse avalanche energy (Note 4) EAS 32.5 mJ
Avalanche current IAR 5 A
Repetitive avalanche energy
Single-device value at dual operation
(Note 2a, 3b, 5)
EAR 0.075 mJ
Channel temperature Tch 150
Storage temperature range Tstg -55~150


Note: (Note 1), (Note 2), (Note 3), (Note 4) and (Note 5): See the next page.

Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).

This transistor is an electrostatic-sensitive device. Please handle with caution.




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