TPCS8008-H

Application• Low drain-source ON-resistance: RDS (ON) = 0.48 (typ.)• High forward transfer admittance: |Yfs| = 1.8 S (typ.)• Low leakage current: IDSS = 100 A (max) (VDS = 250 V)• Enhancement model: Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA)• Low drain-source ON-resista...

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SeekIC No. : 004526239 Detail

TPCS8008-H: Application• Low drain-source ON-resistance: RDS (ON) = 0.48 (typ.)• High forward transfer admittance: |Yfs| = 1.8 S (typ.)• Low leakage current: IDSS = 100 A (max) (VDS = 250 V)&...

floor Price/Ceiling Price

Part Number:
TPCS8008-H
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/11

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Product Details

Description



Application

• Low drain-source ON-resistance: RDS (ON) = 0.48 (typ.)
• High forward transfer admittance: |Yfs| = 1.8 S (typ.)
• Low leakage current: IDSS = 100 A (max) (VDS = 250 V)
• Enhancement model: Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA)


• Low drain-source ON-resistance: RDS (ON) = 0.48 (typ.)
• High forward transfer admittance: |Yfs| = 1.8 S (typ.)
• Low leakage current: IDSS = 100 A (max) (VDS = 250 V)
• Enhancement model: Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA)





Specifications

Characteristic
Symbol
Rating
Unit
Drain-source voltage
VDSS
250
V
Drain-gate voltage (RGS = 20 k)
VDGR
250
V
Gate-source voltage
VGSS
±20
V
Drain current DC (Note 1)
ID
1.7
A
Pulse (Note 1)
IDP
6.8
Drain power dissipation (t = 10 s)
(Note 2a)
PD
1.5
W
Drain power dissipation (t = 10 s)
(Note 2b)
PD
0.6
Single-pulse avalanche energy(Note3)
EAS
1.7
mJ
Avalanche current
IAR
1.7
A
Repetitive avalanche energy
(Note2a, Note 4)
EAR
0.15
mJ
Channel temperature
Tch
150
Storage temperature range
Tstg
−55~150

Note: For Notes 1 to 4, refer to the next page. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
This transistor is an electrostatic-sensitive device. Handle with care.



Characteristic
Symbol
Rating
Unit
Drain-source voltage
VDSS
250
V
Drain-gate voltage (RGS = 20 k)
VDGR
250
V
Gate-source voltage
VGSS
±20
V
Drain current DC (Note 1)
ID
1.7
A
Pulse (Note 1)
IDP
6.8
Drain power dissipation (t = 10 s)
(Note 2a)
PD
1.5
W
Drain power dissipation (t = 10 s)
(Note 2b)
PD
0.6
Single-pulse avalanche energy(Note3)
EAS
1.7
mJ
Avalanche current
IAR
1.7
A
Repetitive avalanche energy
(Note2a, Note 4)
EAR
0.15
mJ
Channel temperature
Tch
150
Storage temperature range
Tstg
−55~150

Note: For Notes 1 to 4, refer to the next page. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
This transistor is an electrostatic-sensitive device. Handle with care.








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