Application• Low drain-source ON-resistance: RDS (ON) = 0.48 (typ.)• High forward transfer admittance: |Yfs| = 1.8 S (typ.)• Low leakage current: IDSS = 100 A (max) (VDS = 250 V)• Enhancement model: Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA)• Low drain-source ON-resista...
TPCS8008-H: Application• Low drain-source ON-resistance: RDS (ON) = 0.48 (typ.)• High forward transfer admittance: |Yfs| = 1.8 S (typ.)• Low leakage current: IDSS = 100 A (max) (VDS = 250 V)&...
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Characteristic |
Symbol |
Rating |
Unit | |
Drain-source voltage |
VDSS |
250 |
V | |
Drain-gate voltage (RGS = 20 k) |
VDGR |
250 |
V | |
Gate-source voltage |
VGSS |
±20 |
V | |
Drain current | DC (Note 1) |
ID |
1.7 |
A |
Pulse (Note 1) |
IDP |
6.8 | ||
Drain power dissipation (t = 10 s) (Note 2a) |
PD |
1.5 |
W | |
Drain power dissipation (t = 10 s) (Note 2b) |
PD |
0.6 | ||
Single-pulse avalanche energy(Note3) |
EAS |
1.7 |
mJ | |
Avalanche current |
IAR |
1.7 |
A | |
Repetitive avalanche energy (Note2a, Note 4) |
EAR |
0.15 |
mJ | |
Channel temperature |
Tch |
150 |
||
Storage temperature range |
Tstg |
−55~150 |
Note: For Notes 1 to 4, refer to the next page. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
This transistor is an electrostatic-sensitive device. Handle with care.
Characteristic |
Symbol |
Rating |
Unit | |
Drain-source voltage |
VDSS |
250 |
V | |
Drain-gate voltage (RGS = 20 k) |
VDGR |
250 |
V | |
Gate-source voltage |
VGSS |
±20 |
V | |
Drain current | DC (Note 1) |
ID |
1.7 |
A |
Pulse (Note 1) |
IDP |
6.8 | ||
Drain power dissipation (t = 10 s) (Note 2a) |
PD |
1.5 |
W | |
Drain power dissipation (t = 10 s) (Note 2b) |
PD |
0.6 | ||
Single-pulse avalanche energy(Note3) |
EAS |
1.7 |
mJ | |
Avalanche current |
IAR |
1.7 |
A | |
Repetitive avalanche energy (Note2a, Note 4) |
EAR |
0.15 |
mJ | |
Channel temperature |
Tch |
150 |
||
Storage temperature range |
Tstg |
−55~150 |
Note: For Notes 1 to 4, refer to the next page. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
This transistor is an electrostatic-sensitive device. Handle with care.