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RFP8N20L

Features: • 8A, 200V• rDS(ON) = 0.600W• Design Optimized for 5V Gate Drives• Can be Driven Directly from QMOS, NMOS,TTL Circuits• Compatible with Automotive Drive Requirements• SOA is Power Dissipation Limited• Nanosecond Switching Speeds• Linear Tra...

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SeekIC No. : 004476652 Detail

RFP8N20L: Features: • 8A, 200V• rDS(ON) = 0.600W• Design Optimized for 5V Gate Drives• Can be Driven Directly from QMOS, NMOS,TTL Circuits• Compatible with Automotive Drive Requi...

RFP8N20L Data Sheet

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Part Number:
RFP8N20L
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• 8A, 200V
• rDS(ON) = 0.600W
• Design Optimized for 5V Gate Drives
• Can be Driven Directly from QMOS, NMOS,TTL Circuits
• Compatible with Automotive Drive Requirements
• SOA is Power Dissipation Limited
• Nanosecond Switching Speeds
• Linear Transfer Characteristics
• High Input Impedence
• Majority Carrier Device
• Related Literature- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"


Specifications

  RFP8N20L UNITS
Drain to Source Voltage (Note 1) VDSS 200 V
Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR 200 V
Continuous Drain Current ID 8 A
Pulsed Drain Current (Note 3) IDM 20 A
Gate to Source Voltage VGS 10 V
Maximum Power Dissipation PD 60 W
Continuous (TC= 100oC, VGS = 10V) (Figure 2) ID 31 A
Pulsed Avalanche Rating UIS Figures 6, 14, 15  
Operating and Storage Temperature .TJ, TSTG -55 to 150 o C
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. TL 300 o C
Package Body for 10s, See Techbrief 334 Tpkg 260 o C



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