NDS8858H

MOSFET CMOSFET Half Bridge

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SeekIC No. : 00162179 Detail

NDS8858H: MOSFET CMOSFET Half Bridge

floor Price/Ceiling Price

Part Number:
NDS8858H
Mfg:
Fairchild Semiconductor
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/9

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Product Details

Quick Details

Transistor Polarity : N and P-Channel Drain-Source Breakdown Voltage : +/- 30 V
Gate-Source Breakdown Voltage : +/- 20 V Continuous Drain Current : 6.3 A, - 4.8 A
Resistance Drain-Source RDS (on) : 0.035 Ohms Configuration : Dual Common Quad Drain
Maximum Operating Temperature : + 150 C Mounting Style : SMD/SMT
Package / Case : SOIC-8 Narrow Packaging : Reel    

Description

Gate-Source Breakdown Voltage : +/- 20 V
Mounting Style : SMD/SMT
Packaging : Reel
Maximum Operating Temperature : + 150 C
Transistor Polarity : N and P-Channel
Package / Case : SOIC-8 Narrow
Drain-Source Breakdown Voltage : +/- 30 V
Resistance Drain-Source RDS (on) : 0.035 Ohms
Configuration : Dual Common Quad Drain
Continuous Drain Current : 6.3 A, - 4.8 A


Features:

`N-Channel 6.3A, 30V, RDS(ON)=0.035  @ VGS=10V. P-Channel -4.8A, -30V, RDS(ON)=0.065  @ VGS=-10V.
`High density cell design or extremely low RDS(ON).
`High power and current handling capability in a widely used surface mount package.
`Matched pair for equal input capacitance and power capability



Specifications

Symbol
Parameter

N-Channel

P-Channel

Units
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
30
20
6.3
20
-30
-20
-4.8
20
V
V
A


W


°C
ID
Drain Current Continuous Pulsed (Note 1a & 2)
PD
Maximum Power Dissipation
(Single Device)
(Note 1a)
(Note 1b)
(Note 1c)
2.5
1.2
1
-55 to 150
TJ,TSTG Operating and Storage Junction Temperature Range
THERMAL CHARACTERISTICS
</TBO
RJA

RJC
Thermal Resistance, Junction-to-Ambient
(Single Device)
Thermal Resistance, Junction-to-Case
(Single Device)
(Note 1a)

(Note 1)

50

25

°C/W

°C/W



Description

These Complementary MOSFET NDS8858H half bridge devices are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulses in the avalanche and commutation modes. NDS8858H is particularly suited for low voltage half bridge applications or CMOS applications when both gates are connected together.




Parameters:

Technical/Catalog InformationNDS8858H
VendorFairchild Semiconductor (VA)
CategoryDiscrete Semiconductor Products
Mounting TypeSurface Mount
FET PolarityN and P-Channel
Drain to Source Voltage (Vdss)30V
Current - Continuous Drain (Id) @ 25° C6.3A, 4.8A
Rds On (Max) @ Id, Vgs35 mOhm @ 4.8A, 10V
Input Capacitance (Ciss) @ Vds 720pF @ 15V
Power - Max1W
PackagingDigi-Reel?
Gate Charge (Qg) @ Vgs30nC @ 10V
Package / CaseSO-8
FET FeatureLogic Level Gate
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names NDS8858H
NDS8858H
NDS8858HDKR ND
NDS8858HDKRND
NDS8858HDKR



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