NDS8839H

MOSFET DISC BY MFG 2/02

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NDS8839H Picture
SeekIC No. : 00165625 Detail

NDS8839H: MOSFET DISC BY MFG 2/02

floor Price/Ceiling Price

Part Number:
NDS8839H
Mfg:
Fairchild Semiconductor
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/9

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Product Details

Quick Details

Transistor Polarity : N and P-Channel Drain-Source Breakdown Voltage : 30 V
Gate-Source Breakdown Voltage : +/- 20 V Continuous Drain Current : 5.7 A, - 4 A
Resistance Drain-Source RDS (on) : 0.045 Ohms Configuration : Dual Common Quad Drain
Maximum Operating Temperature : + 150 C Mounting Style : SMD/SMT
Package / Case : SOIC-8 Narrow Packaging : Reel    

Description

Gate-Source Breakdown Voltage : +/- 20 V
Mounting Style : SMD/SMT
Packaging : Reel
Drain-Source Breakdown Voltage : 30 V
Maximum Operating Temperature : + 150 C
Transistor Polarity : N and P-Channel
Package / Case : SOIC-8 Narrow
Resistance Drain-Source RDS (on) : 0.045 Ohms
Configuration : Dual Common Quad Drain
Continuous Drain Current : 5.7 A, - 4 A


Features:

`N-Channel 5.7A, 30V, RDS(ON)=0.045 @ VGS=10V. P-Channel -4.0A, -30V, RDS(ON)=0.09 @ VGS=-10V.
`High density cell design or extremely low RDS(ON).
`High power and current handling capability in a widely used surface mount package.
`Matched pair for equal input capacitance and power capability



Specifications

Symbol
Parameter

N-Channel

P-Channel

Units
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
30
20
5.7
15
-30
-20
-4
15
V
V
A


W


°C
ID
Drain Current Continuous Pulsed (Note 1)
PD
Maximum Power Dissipation
(Single Device)
(Note 1a)
(Note 1b)
(Note 1c)
2.5
1.2
1
-55 to 150
TJ,TSTG Operating and Storage Junction Temperature Range
THERMAL CHARACTERISTICS
RJA
RJC
Thermal Resistance, Junction-to-Ambient
(Single Device)
Thermal Resistance, Junction-to-Case
(Single Device)
(Note 1a)
(Note 1)

50

25

°C/W

°C/W



Description

These Complementary MOSFET NDS8839H half bridge devices are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulses in the avalanche and commutation modes. NDS8839H is particularly suited for low voltage half bridge applications or CMOS applications when both gates are connected together.




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