LX5506E

Features: · Advanced InGaP HBT· 4.9-5.85GHz Operation·Single-Polarity 3.3V Supply·Total Current ~ 200mA for Pout=19dBm at 5.25GHz· P1dB > +26dBm·Power Gain ~ 23dB at 5.25GHz & Pout=19dBm·EVM ~ 3% for 64QAM/ 54Mbps & Pout=19dBm·Integrated Power Detectors·On-Chip Input Match· Simple Outpu...

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SeekIC No. : 004403504 Detail

LX5506E: Features: · Advanced InGaP HBT· 4.9-5.85GHz Operation·Single-Polarity 3.3V Supply·Total Current ~ 200mA for Pout=19dBm at 5.25GHz· P1dB > +26dBm·Power Gain ~ 23dB at 5.25GHz & Pout=19dBm·EVM ...

floor Price/Ceiling Price

Part Number:
LX5506E
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/9/27

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Product Details

Description



Features:

· Advanced InGaP HBT
· 4.9-5.85GHz Operation
·Single-Polarity 3.3V Supply
·Total Current ~ 200mA for Pout=19dBm at 5.25GHz
· P1dB > +26dBm
·Power Gain ~ 23dB at 5.25GHz & Pout=19dBm
·EVM ~ 3% for 64QAM/ 54Mbps & Pout=19dBm
·Integrated Power Detectors
·On-Chip Input Match
· Simple Output Match
·Minimal External Components
· Small Footprint: 3x3mm2
· Low Profile: 0.9mm




Application

·FCC U-N11 Wireless
· IEEE 802.11a
· HiperLAN2



Specifications

DC Supply Voltage, RF Off...............................................................................6V
Collector Current .....................................................................................500mA
Total Power Dissipation............................................................................. ...3W
RF Input Power........................................................................................10dBm
Operation Ambient Temperature .................................................-40 to +85°C
Storage Temperature....................................................................-60 to 150°C
 
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of specified terminal.



Description

The LX5506E is a power amplifier optimized for the FCC Unlicensed National Information Infrastructure (U-NII) band, HyperLAN2 and Japan WLAN applications in the 4.9-5.85 GHz frequency range. The PA is   implemented as a three-stage monolithic microwave integrated circuit (MMIC) with active bias, onchip input matching and output prematching. The device is manufactured with an InGaP/GaAs Heterojunction Bipolar Transistor (HBT) IC process (MOCVD). It also has an integrated differential output power detector pair to help reduce BOM cost and PCB board space for system implementation.

LX5506E is available in a 16-pin 3mmx3mm micro-lead package (MLP). The compact footprint, low profile, and excellent thermal capability of the MLP package makes the LX5506E an ideal solution for broadband, high-gain power amplifier requirements for IEEE 802.11a, and Hiperlan2 portable WLAN applications.




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