HPMX-5001

Features: • 2.7 V Single Supply Voltage• Low Power Consumption (60 mA in Transmit Mode, 39 mA in Receive Mode Typical)• 2 dBm Typical Transmit Power at 1900 MHz• Half-Frequency VCO with Frequency Doubler • 32/33 Dual-Modulus Prescaler• Flexible Chip Biasing, Inc...

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HPMX-5001 Picture
SeekIC No. : 004365343 Detail

HPMX-5001: Features: • 2.7 V Single Supply Voltage• Low Power Consumption (60 mA in Transmit Mode, 39 mA in Receive Mode Typical)• 2 dBm Typical Transmit Power at 1900 MHz• Half-Frequen...

floor Price/Ceiling Price

Part Number:
HPMX-5001
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/11/27

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Product Details

Description



Features:

• 2.7 V Single Supply Voltage
• Low Power Consumption (60 mA in Transmit Mode, 39 mA in Receive Mode Typical)
• 2 dBm Typical Transmit Power at 1900 MHz
• Half-Frequency VCO with Frequency Doubler
• 32/33 Dual-Modulus Prescaler
• Flexible Chip Biasing, Including Standby Mode
• TQFP-32 Surface Mount Package
• Operation to 2.5 GHz
•Use with Companion HPMX-5002 IF chip



Application

• DECT, UPCS and ISM Band Handsets and Basestations


Pinout

  Connection Diagram


Specifications

Parameter
Min.
Max.
VCC Supply Voltage
-0.2 V
8 V
Voltage at Any Pin[4]
-0.2 V
VCC + 0.2 V
Power Dissipation[2,3]
600 mW
RF Input Power
15 dBm
Junction Temperature
+150°C
Storage Temperature
-55°C
+125°C



Description

The HPMX-5001 Upconverter/ Downconverter provides RF system designers with all of the necessary features to perform an RF-to-IF downconversion for a receive path, as well as an IF-to- RF upconversion for transmit mode.

Designed to meet the unique needs of portable applications, the HPMX-5001 combines the qualities of flexible chip biasing, low power consumption, and true 2.7 V minimum supply voltage operation to provide superior performance and battery life. By incorporating the active elements of the VCO on-chip, as well as a 32/33 dual-modulus prescaler, overall system component count and costs are decreased. The 32-TQFP package insures that this high level of integration occupies a small amount of printed circuit board space.

The HPMX-5001 can be used in either dual-conversion systems (with the HPMX-5002 IF Demodulator/Modulator) or single-conversion systems. It is manufactured using Hewlett-Packard's HP-25 Silicon Bipolar Process with 25 GHz f T and 30 GHz fMax.




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