Features: • 2.7 V Single Supply Voltage• Low Power Consumption (60 mA in Transmit Mode, 39 mA in Receive Mode Typical)• 2 dBm Typical Transmit Power at 1900 MHz• Half-Frequency VCO with Frequency Doubler • 32/33 Dual-Modulus Prescaler• Flexible Chip Biasing, Inc...
HPMX-5001: Features: • 2.7 V Single Supply Voltage• Low Power Consumption (60 mA in Transmit Mode, 39 mA in Receive Mode Typical)• 2 dBm Typical Transmit Power at 1900 MHz• Half-Frequen...
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Parameter |
Min. |
Max. |
VCC Supply Voltage | -0.2 V |
8 V |
Voltage at Any Pin[4] | -0.2 V |
VCC + 0.2 V |
Power Dissipation[2,3] | 600 mW |
|
RF Input Power | 15 dBm |
|
Junction Temperature | +150°C |
|
Storage Temperature | -55°C |
+125°C |
The HPMX-5001 Upconverter/ Downconverter provides RF system designers with all of the necessary features to perform an RF-to-IF downconversion for a receive path, as well as an IF-to- RF upconversion for transmit mode.
Designed to meet the unique needs of portable applications, the HPMX-5001 combines the qualities of flexible chip biasing, low power consumption, and true 2.7 V minimum supply voltage operation to provide superior performance and battery life. By incorporating the active elements of the VCO on-chip, as well as a 32/33 dual-modulus prescaler, overall system component count and costs are decreased. The 32-TQFP package insures that this high level of integration occupies a small amount of printed circuit board space.
The HPMX-5001 can be used in either dual-conversion systems (with the HPMX-5002 IF Demodulator/Modulator) or single-conversion systems. It is manufactured using Hewlett-Packard's HP-25 Silicon Bipolar Process with 25 GHz f T and 30 GHz fMax.