HN2E01F

Features: Q1Low Forward Voltage Drop : VF(3)=0.98V(typ.)Fast Reverse Recovery Time : trr=1.6ns(typ.)Low Total Capacitance : CT=0.5pF(typ.)Q2High DC Current Gain : hFE=600~3600High Voltage : VCEO=50VHigh Collector Current : IC=150mA(max.)Q1 (Diode) : 1SS352 EquivalentQ2 (Transistor) : 2SC4666 Equiv...

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SeekIC No. : 004365009 Detail

HN2E01F: Features: Q1Low Forward Voltage Drop : VF(3)=0.98V(typ.)Fast Reverse Recovery Time : trr=1.6ns(typ.)Low Total Capacitance : CT=0.5pF(typ.)Q2High DC Current Gain : hFE=600~3600High Voltage : VCEO=50V...

floor Price/Ceiling Price

Part Number:
HN2E01F
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/6/5

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Product Details

Description



Features:

Q1
Low Forward Voltage Drop : VF(3)=0.98V(typ.)
Fast Reverse Recovery Time : trr=1.6ns(typ.)
Low Total Capacitance : CT=0.5pF(typ.)
Q2
High DC Current Gain : hFE=600~3600
High Voltage : VCEO=50V
High Collector Current : IC=150mA(max.)
Q1 (Diode) : 1SS352 Equivalent
Q2 (Transistor) : 2SC4666 Equivalent



Specifications

Q1 (Diode)

Characteristic
Symbol
Rating
Unit
Maximum (peak) reverse voltage
VRM
85
V
Reverse voltage
VR
80
V
Maximum (peak) forward current
IFM
300
mA
Average forward current
IO
100
mA
Surge current (10ms)
IFSM
1
A
Q2 (Transistor)
Characteristic
Symbol
Rating
Unit
Collector-base voltage
VCBO
50
V
Collector-emitter voltage
VCEO
50
V
Emitter-base voltage
VEBO
5
V
Collector current
IC
150
mA
Base current
IB
30
mA
Characteristic
Symbol
Rating
Unit
Collector power dissipation
PC*
300
mW
Junction temperature
Tj
125
Storage temperature range
Tstg
−55~125

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  "Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).

* Total rating: 200mW per element should not be exceeded.




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