SpecificationsQ1(Transistor)Collector-base voltage VCBO ..................−50 VCollector-emitter voltage VCEO.............. −50 VEmitter-base voltage VEBO ....................−10 VCollector current IC ...........................−100 mAQ2(Diode)Maximum (peak) reverse voltage...
HN2E05J: SpecificationsQ1(Transistor)Collector-base voltage VCBO ..................−50 VCollector-emitter voltage VCEO.............. −50 VEmitter-base voltage VEBO ....................−10 V...
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Transistors Bipolar (BJT) Small Signal SBD + PNP (BRT)
Q1(Transistor)
Collector-base voltage VCBO ..................−50 V
Collector-emitter voltage VCEO.............. −50 V
Emitter-base voltage VEBO ....................−10 V
Collector current IC ...........................−100 mA
Q2(Diode)
Maximum (peak) reverse voltage VRM..... 85 V
Reverse voltage VR .................................80 V
Maximum (peak) forward current IFM...200 mA
Average forward current IO ................100 mA
Surge current (10ms) IFSM ........................1 A
Q1, Q2 Common
Collector power dissipation PC*........ 300 mW
Junction temperature Tj ......................150
Storage temperature range Tstg .....−55~150
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
* Total rating. 200mW per 1 element must not be exceeded.