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GP1601FSS18

Features: Low VCE(SAT) Non Punch Through Silicon Isolated Copper Baseplate Low Inductance Internal Construction 1600A Per moduleApplication High Reliability Inverters Motor Controllers Traction Drives Resonant ConvertersPinoutSpecifications Symbol Parameter Test Conditions Max. Units ...

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SeekIC No. : 004354904 Detail

GP1601FSS18: Features: Low VCE(SAT) Non Punch Through Silicon Isolated Copper Baseplate Low Inductance Internal Construction 1600A Per moduleApplication High Reliability Inverters Motor Controllers Traction Dri...

GP1601FSS18 Data Sheet

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Part Number:
GP1601FSS18
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

Low VCE(SAT)
 Non Punch Through Silicon
Isolated Copper Baseplate
Low Inductance Internal Construction
1600A Per module


Application

High Reliability Inverters
Motor Controllers
Traction Drives
Resonant Converters


Pinout

Connection Diagram


Specifications

Symbol Parameter Test Conditions Max. Units
VCES Collector-emitter voltage VGE = 0V 1800 V
VCES Gate-emitter voltage   ±20 V
IC Continuous collector current Tcase = 70°C for Tj = 125°C 1600 A
IC(PK) Peak collector current 1ms, Tcase = 115˚C 3200 A
Pmax Max. transistor power dissipation Tcase = 25˚C, Tj = 150˚C 11.4 kW
Visol Isolation voltage Commoned terminals to base plate. AC RMS, 1 min, 50Hz 4000 V



Description

The Powerline range of high power modules GP1601FSS18 includes dual and single switch configurations covering voltages from 600V to 3300V and currents up to 4800A.

The GP1601FSS18 is a single switch 1800V, n channel enhancement mode, insulated gate bipolar transistor (IGBT) module. Designed with low VCE(SAT) to minimise conduction losses, the module is of particular relevance in low to medium frequency applications. The IGBT has a wide reverse bias safe operating area (RBSOA) ensuring reliability in demanding applications.

The GP1601FSS18 incorporates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise earthed heat sinks for safety.




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