Features: High Thermal Cycling Capability 1600A Per Module Non Punch Through Silicon Isolated MMC Base with AlN SubstratesApplication High Reliability Inverters Motor Controllers Traction Drives Resonant ConvertersPinoutSpecifications Symbol Parameter Test Conditions Max. Units VCES ...
GP1600FSM18: Features: High Thermal Cycling Capability 1600A Per Module Non Punch Through Silicon Isolated MMC Base with AlN SubstratesApplication High Reliability Inverters Motor Controllers Traction Drives Re...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
Features: · High Thermal Cycling Capability· 1600A Per Module· Non Punch Through Silicon· Isolated...
Features: n - Channel Enhancement Mode High Input Impedance Optimised For High Power High Frequen...
Symbol | Parameter | Test Conditions | Max. | Units |
VCES | Collector-emitter voltage | VGE = 0V | 1800 | V |
VCES | Gate-emitter voltage | ±20 | V | |
IC | Continuous collector current | Tcase = 65°C for Tj = 125°C | 1600 | A |
IC(PK) | Peak collector current | 1ms, Tcase = 110˚C | 2400 | A |
Pmax | Max. transistor power dissipation | Tcase = 25˚C, Tj = 150˚C | 13.9 | kW |
Visol | Isolation voltage | Commoned terminals to base plate. AC RMS, 1 min, 50Hz | 4000 | V |