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GP1600FSM12

Features: · High Thermal Cycling Capability· 1600A Per Module· Non Punch Through Silicon· Isolated MMC Base with AlN SubstratesApplication· High Reliability Inverters· Motor Controllers· Traction Drives· Resonant ConvertersSpecifications Symbol Parameter Test Conditions Max. Units ...

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SeekIC No. : 004354901 Detail

GP1600FSM12: Features: · High Thermal Cycling Capability· 1600A Per Module· Non Punch Through Silicon· Isolated MMC Base with AlN SubstratesApplication· High Reliability Inverters· Motor Controllers· Traction Dr...

GP1600FSM12 Data Sheet

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Part Number:
GP1600FSM12
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

·  High Thermal Cycling Capability
·  1600A Per Module
·  Non Punch Through Silicon
·  Isolated MMC Base with AlN Substrates


Application

· High Reliability Inverters
· Motor Controllers
· Traction Drives
· Resonant Converters


Specifications

Symbol
 Parameter Test Conditions
Max.
Units
VCES
 Collector-emitter voltage VGE = 0V
1200
V
VGES
 Gate-emitter voltage -
±20
V
IC
 Collector current DC, Tcase = 82˚C
1600
A
ICM
 1ms, Tcase = 112˚C
3200
A
Pmax
 Maximum power dissipation Tcase = 25˚C (Transistor)
13.9
kW
Visol
 Isolation voltage Commoned terminals to base plate.
AC RMS, 1 min, 50Hz
2500
V



Description

The Powerline range of high power modules of GP1600FSM12 includes half bridge, chopper, dual and single switch configurations covering voltages from 600V to 3300V and currents up to 2400A.

The GP1600FSM12 is a singlel switch 1200V, n channel enhancement mode, insulated gate bipolar transistor (IGBT)module. The IGBT has a wide reverse bias safe operating area (RBSOA) ensuring reliability in demanding applications. GP1600FSM12 is optimised for traction drives and other applications requiring high thermal cycling capability or very high reliability.

The GP1600FSM12 incorporates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise earthed heat sinks for safety.




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