Industry News (2012/06/05)

Freescale develops black-box sensor integration for Win8

Published:2012/6/5 21:19:00 Author:Ecco

Freescale Semiconductor plans to develop Windows 8 with a 12-axis sensor development reference platform which is a kind of black-box of sensor integration. The platform aims to dramatically reduce system complexity by the components which include an Xtrinsic MPL3115A2 precision altimeter, Xtrinsic MMA8451Q 3-axis accelerome...   (View)

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SanDisk can provide samples of 19-nm iNAND Extreme

Published:2012/6/5 3:31:00 Author:Ecco

SanDisk Corp. announced its iNAND Extreme NAND flash memory using 19-nm process technology on Monday (June 4). It is the most advanced process technology for memory chips now. SanDisk planed to provide details of its NAND flash implemented at 19-nm at the International Solid State Circuits Conference in February. According to...   (View)

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GloFo, TSMC announce their process tech progress

Published:2012/6/5 1:53:00 Author:Ecco

Globalfoundries and its larger competitor TSMC reported their process tech progress. Globalfoundries had four flavors of its 28nm process and 3-D IC technology. TSMC reported progress in the same three areas working in collaboration with Cadence Design Systems. For Globalfoundries,...   (View)

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ST has mass-produced MEMS microphones with plastic packages

Published:2012/6/5 1:06:00 Author:Ecco

STMicroelectronics NV has pushed mass-produced MEMS microphones which make the company be the first one. The products are available in plastic packages. The technology is patented for ST while it can save space and increase durability simultaneously. ST’s MEMS microphones are suitable for assembly on flat-cable printed-circuit <...   (View)

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