GloFo, TSMC announce their process tech progress

Published:2012/6/5 1:53:00 Author:Ecco From:SeekIC

Globalfoundries and its larger competitor TSMC reported their process tech progress. Globalfoundries had four flavors of its 28nm process and 3-D IC technology. TSMC reported progress in the same three areas working in collaboration with Cadence Design Systems.

For Globalfoundries, the low power version for mobile chips and a low cost polysilicon version without high-k metal gates are available. The company estimates only about ten percent of its total 90,000 wafers/month capacity will come from its Fab 8 by the end of the year. Since the foundry spends an estimated $3 billion in capital equipment this year, the capacity could be expanded to 180,000 wafers/month after 12 months.

At the same time, there are about three companies being participating in Globalfoundries’ first multi-process wafer to qualify its 20 nm process also in New York. The company expects to run several of the shuttles this year so it can start 20 nm production early in 2013 with tested third-party IP where needed.

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