MFG:Texas Instruments Category:Integrated Circuits (ICs) Package Cooled:BGA D/C:09+
XIO2200, XIO2200A, XIO2200AGGW Datasheet download
Category: Integrated Circuits (ICs)
MFG: Texas Instruments
Package Cooled: BGA
D/C: 09+
Description: IC PCI-EXPRESS/BUS BRIDGE 176BGA
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Datasheet: XIO2200AGGW
File Size: 2344194 KB
Manufacturer: Texas Instruments
Download : Click here to Download
PDF/DataSheet Download
Datasheet: XIO2200AGGW
File Size: 2344194 KB
Manufacturer: Texas Instruments
Download : Click here to Download
PDF/DataSheet Download
Datasheet: XIO2200AGGW
File Size: 2344194 KB
Manufacturer: Texas Instruments
Download : Click here to Download
The XIO2200A is a single-function PCI Express to PCI translation bridge where the PCI bus interface is internally connected to a 1394a open host controller link-layer controller with a two-port 1394a PHY. The PCI-Express to PCI translation bridge is fully compatible with the PCI Express to PCI/PCI-X Bridge Specification, Revision 1.0. Also, the bridge supports the standard PCI-to-PCI bridge programming model.
The 1394a OHCI controller function is fully compatible with IEEE Standard 1394a-2000 and the latest 1394 Open Host Controller Interface (OHCI) Specification.
For downstream traffic, the PCI Express to PCI translation bridge simultaneously supports up to eight posted and four nonposted transactions for each enabled virtual channel (VC). For upstream traffic, up to six posted and four nonposted transactions are simultaneously supported for each VC.
The PCI Express interface supports a x1 link operating at full 250 MB/s packet throughput in each direction imultaneously. Two independent VCs are supported. The second VC is optimized for isochronous traffic types and quality-of-service (QoS) applications. Also, the bridge supports the advanced error reporting capability including ECRC as defined in the PCI Express Base Specification, Revision 1.0a. Supplemental firmware or software is required to fully utilize both of these features.
Robust pipeline architecture is implemented to minimize system latency across the bridge. If parity errors are detected, then packet poisoning is supported for both upstream and downstream operations.
Deep FIFOs are provided to buffer 1394 data and accommodate large host bus latencies. The bridge provides physical write posting and a highly tuned physical data path for SBP-2 performance. The bridge is capable of transferring data between the PCI Express bus and the 1394 bus at 100M bits/s, 200M bits/s, and 400M bits/s. The bridge provides two 1394 ports that have separate cable bias (TPBIAS). The bridge also supports the IEEE Std 1394a-2000 power-down features for battery-operated applications and arbitration enhancements.
As required by the 1394 Open Host Controller Interface Specification and IEEE Std 1394a-2000, internal control registers are memory-mapped and nonprefetchable. This configuration header is accessed through nfiguration cycles specified by PCI Express, and it provides plug-and-play (PnP) compatibility.
The PHY-layer provides the digital and analog transceiver functions needed to implement a two-port node in a cable-based 1394 network. Each cable port incorporates two differential line transceivers. The transceivers include circuitry to monitor the line conditions as needed for determining connection status, for initialization and arbitration, and for packet reception and transmission. An external 2-wire serial EEPROM interface is provided to load the global unique ID for the 1394 fabric.
Power management (PM) features include active state link PM, PME mechanisms, the beacon and wake protocols, and all conventional PCI D-states. If the active state link PM is enabled, then the link automatically saves power when idle using the L0s and L1 states. PM active state NAK, PM PME, and PME-to-ACK messages are supported.
Eight general-purpose inputs and outputs (GPIOs), configured through accesses to the PCI Express configuration space, allow for further system control and customization.
Supply voltage range: VDD_33 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.5 V to 3.6 V
VDD_15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . .. . . .. . . .. .0.5 V to 1.65 V
Input voltage range, VI: PCI Express (RX) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.6 V to 0.6 V
VI: PCI Express REFCLK (single-ended) . . . . . . . . . . . . . . . .. . . .. . . .. . . .. . . .. . . 0.5 V to VDD_33 + 0.5 V
VI: PCI Express REFCLK (differential) . . . . . . . . . . . . . .. . . .. . . .. . . .. . . .. . . .. . . . 0.5 V toVDD_15 + 0.5 V
VI: Miscellaneous 3.3-V IO . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . .. . . .. . . .. . . . . 0.5 V to VDD_33 + 0.5 V
VI: 1394a PHY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . .. . . .. . . .. . . .. . . . . 0.5 V to VDD_33 + 0.5 V
Output voltage range: VO: PCI Express (TX) . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . 0.5 V to VDD_15 + 0.5V
VO: Miscellaneous 3.3-V IO . . . . . . . . . . . . . . . . . . . . . .. . . .. . . .. . . .. . . .. . . .. . . 0.5 V to VDD_33 + 0.5 V
VO: 1394a PHY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . .. . . .. . . .. . . .. . .0.5 V to VDD_33 + 0.5 V
Input clamp current, (VI < 0 or VI > VDD) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, (VO < 0 or VO > VDD) (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Human body model (HBM) ESD performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1500 V
Charged device model (CDM) ESD performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 V
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65 to 150
† Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Applies for external input and bidirectional buffers. VI < 0 or VI > VDD or VI > VCCP.
2. Applies to external output and bidirectional buffers. VO < 0 or VO > VDD or VO > VCCP.
· Full x1 PCI Express Throughput
· Fully Compliant with PCI Express to PCI/PCI-X Bridge Specification, Revision 1.0
· Fully Compliant with PCI Express Base Specification, Revision 1.0a
· Fully Compliant with PCI Local Bus Specification, Revision 2.3
· A Second Virtual Channel for Quality-of-Service and Isochronous Applications
· Advanced PCI Isochronous Windows for Memory Space Mapping to a Specified Traffic Class
· Utilizes 100-MHz Differential PCI Express Common Reference Clock or 125-MHz Single-Ended Reference Clock
· Fully Compliant With Provisions of IEEE Std 1394-1995 for a High-Performance Serial Bus and IEEE Std 1394a-2000.
· Fully Compliant with 1394 Open Host Controller Interface Specification, Revision 1.1
· Full IEEE Std 1394a−2000 Support Includes: Connection Debounce, Arbitrated Short Reset, Multispeed Concatenation, Arbitration Acceleration, Fly-by Concatenation, and Port Disable/Suspend/Resume
· Two IEEE Std 1394a-2000 Fully Compliant Cable Ports at 100M Bits/s, 200M Bits/s, and 400M Bits/s
· Cable Ports Monitor Line Conditions for Active Connection To Remote Node
· Cable Power Presence Monitoring
· EEPROM Configuration Support to Load the Global Unique ID for the 1394 Fabric
· Wake Event and Beacon Support
· Support for D1, D2, D3hot, and D3cold
· Active State Link Power Management Saves Power When Packet Activity on the PCI Express Link is Idle, Using Both L0s and L1 States
· Integrated AUX Power Switch Drains VAUX Power Only When Main Power Is Off
· Eight 3.3-V, Multifunction, General-Purpose I/O Terminals
· Compact Footprint, 176-Ball, GGW MicroStarTM BGA or Lead-Free 176-Ball, ZGW MicroStarTM BGA
| Technical/Catalog Information | XIO2200AGGW |
| Vendor | Texas Instruments |
| Category | Integrated Circuits (ICs) |
| Applications | PCI Express to PCI Translation Bridge |
| Interface | PCI |
| Voltage - Supply | 1.35 V ~ 1.65 V, 3 V ~ 3.6 V |
| Package / Case | 176-BGA MICROSTAR |
| Packaging | Tray |
| Drawing Number | 296; 4145255-2; GGW; 176 |
| Lead Free Status | Contains Lead |
| RoHS Status | RoHS Non-Compliant |
| Other Names | XIO2200AGGW XIO2200AGGW 296 19617 ND 29619617ND 296-19617 |
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