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XCF026, XCF02S, XCF02STMV

Table of contents:
Info of XCF026
Info of XCF02S
Info of XCF02STMV

XCF026, XCF02S, XCF02STMV Selling Leads, Datasheet

MFG:40 Package Cooled:TSSOP20 D/C:08+

XCF026, XCF02S, XCF02STMV Datasheet download

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Part Number: XCF026

MFG: 40

Package Cooled: TSSOP20

D/C: 08+

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XCF02S General Description

Xilinx introduces the Platform Flash series of in-system programmable configuration PROMs. Available in 1 to 32 Megabit (Mbit) densities, these PROMs provide an easy-to-use, cost-effective, and reprogrammable method for storing large Xilinx FPGA configuration bitstreams. The Platform Flash PROM series includes both the 3.3V XCFxxS PROM and the 1.8V XCFxxP PROM. The XCFxxS version includes 4-Mbit, 2-Mbit, and 1-Mbit PROMs that support Master Serial and Slave Serial FPGA configuration modes (Figure 1). The XCFxxP version includes 32-Mbit, 16-Mbit, and 8-Mbit PROMs that support Master Serial, Slave Serial, Master SelectMAP, and Slave SelectMAP FPGA configuration modes (Figure 2). A summary of the Platform Flash PROM family members and supported features is shown in Table 1.

XCF02S Maximum Ratings

Symbol	Description		XCF01S, XCF02S, XCF04S	XCF08P, XCF16P, XCF32P	Units
V_CCINT	Internal supply voltage relative to GND		0.5 to +4.0	0.5 to +2.7	V
V_CCO	I/O supply voltage relative to GND		0.5 to +4.0	0.5 to +4.0	V
V_CCJ	JTAG I/O supply voltage relative to GND		0.5 to +4.0	0.5 to +4.0	V
V_IN	Input voltage with respect to GND	V_CCO < 2.5V	0.5 to +3.6	0.5 to V_CCO+0.5	V
V_IN	Input voltage with respect to GND	V_CCO 2.5V	0.5 to +5.5	0.5 to V_CCO+0.5	V
V_TS	Voltage applied to High-Z output	V_CCO < 2.5V	0.5 to +3.6	0.5 to V_CCO+0.5	V
V_TS	Voltage applied to High-Z output	V_CCO 2.5V	0.5 to +5.5	0.5 to V_CCO+0.5	V
T_STG	Storage temperature (ambient)		65 to +150	65 to +150
T_SOL⁽³⁾	Maximum soldering temperature (10s @ 1/16 in.)		+220	+220
T_J	Junction temperature		+125	+125

Notes:
1. Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During transitions, the device pins can undershoot to 2.0V or overshoot to +7.0V, provided this over- or undershoot lasts less then 10 ns and with the forcing current being limited to 200 mA.
2. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time adversely affects device reliability.
3. For soldering guidelines, see the information on "Packaging and Thermal Characteristics" at www.xilinx.com.

XCF02S Features

• In-System Programmable PROMs for Configuration of Xilinx FPGAs
• Low-Power Advanced CMOS FLASH Process
• Endurance of 20,000 Program/Erase Cycles
• Operation over Full Industrial Temperature Range (40 to +85)
• Available in small footprint packages: VO20, VO48, and FS48
• IEEE Standard 1149.1/1532 Boundary-Scan (JTAG) Support for Programming, Prototyping, and Testing
• JTAG Command Initiation of Standard FPGA Configuration
• Cascadable for Storing Longer or Multiple Bitstreams
• Dedicated Boundary-Scan (JTAG) I/O Power Supply (V_CCJ)
• I/O Pins Compatible with Voltage Levels Ranging From 1.5V to 3.3V
• Design Support Using the Xilinx Alliance ISE and Foundation ISE Series Software Packages
• XCF01S/XCF02S/XCF04S
- 3.3V supply voltage
- Serial FPGA configuration interface
• XCF08P/XCF16P/XCF32P
- 1.8V supply voltage
- Serial or parallel FPGA configuration interface
- Design revision technology enables storing and accessing multiple design revisions for configuration
- Built-in data decompressor compatible with Xilinx advanced compression technology

XCF02S Connection Diagram

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