W574, W58100, W581057801H Selling Leads, Datasheet
MFG:WST Package Cooled:TO-92 D/C:06+
W574, W58100, W581057801H Datasheet download
Part Number: W574
MFG: WST
Package Cooled: TO-92
D/C: 06+
MFG:WST Package Cooled:TO-92 D/C:06+
W574, W58100, W581057801H Datasheet download
MFG: WST
Package Cooled: TO-92
D/C: 06+
Want to post a buying lead? If you are not a member yet, please select the specific/related part number first and then fill the quantity and your contact details in the "Request for Quotation Form" on the left, and then click "Send RFQ".Your buying lead can then be posted, and the reliable suppliers will quote via our online message system or other channels soon.
TOP
PDF/DataSheet Download
Datasheet:
File Size: KB
Manufacturer:
Download : Click here to Download
PDF/DataSheet Download
Datasheet: W5830
File Size: 132241 KB
Manufacturer: WINBOND [Winbond]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: W5830
File Size: 132241 KB
Manufacturer: WINBOND [Winbond]
Download : Click here to Download
The W58100 is a CMOS IC that is used solely for the purpose of demonstrating the W581xx series enhanced PowerSpeechä products.
The W58100 employs the same JUMP-GO architecture as Winbond's other PowerSpeechä products. Unlike standard products, however, the W58100 does not include built-in memory, because the chip is designed to serve only as a demonstration chip for the W581xx series ICs. Hence the W58100 must be operated with an external memory device (e.g., a flash EPROM memory IC). The W58100's LOAD and JUMP commands and 8 programmable registers provide powerful user-programmable functions that make this chip suitable for a wide range of speech IC applications.
PARAMETER |
SYMBOL |
CONDITIONS |
RATED |
UNIT |
Power Supply |
VDD-VSS |
- |
-0.3 to +7.0 |
V |
Input Voltage |
VIN |
All Inputs |
VSS -0.3 to VDD +0.3 |
V |
Storage Temp. |
TSTG |
- |
-55 to +150 |
°C |
Operating Temp. |
TOPR |
- |
0 to +70 |
°C |