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The VND10N06, VND10N06-1, VNP10N06FI and VNK10N06FM are monolithic devices made using SGS-THOMSON Vertical Intelligent Power M0 Technology, intended for replacement of standard power MOSFETS in DC to 50 KHz applications. Built-in thermal shut-down, linear current limitation and overvoltage clamp protect the chip in harsh enviroments.
VND10N06-1 Maximum Ratings
Symbol
Parameter
Value
Unit
DPAK IPAK
ISOWATT220
SOT82-FM
VDS
Drain-source Voltage (Vin = 0)
Internally Clamped
V
VIN
Input Voltage
Internally Clamped
V
Iin
Input Current
±20
mA
ID
Drain Current
Internally Clamped
A
IR
Reverse DC Output Current
-15
A
Vesd
Electrostatic discharge(C= 100 pF, R=1.5 K)
4000
V
Ptot
Total Dissipation at TC=25°C
35
27
9
W
Tj
Operating Junction Temperature
Internally Limited
TC
Case operating temperature
Internally Limited
Tstg
Storage Temperature
-55 to 150
VND10N06-1 Features
During Normal Operation, the INPUT pin is electrically connected to the gate of the internal power MOSFET through a low impedance path as soon as VIN > VIH.
The device then behaves like a standard power MOSFET and can be used as a switch from DC to 50KHz. The only difference from the user's standpoint is that a small DC current (typically 150 mA) flows into the INPUT pin in order to supply the internal circuitry.
During turn-off of an unclamped inductive load the output voltage is clamped to a safe level by an integrated Zener clamp between DRAIN pin and the gate of the internal Power MOSFET.
In this condition, the Power MOSFET gate is set to a voltage high enough to sustain the inductive load current even if the INPUT pin is driven to 0V. The device integrates an active current limiter circuit which limits the drain current ID to Ilim whatever the INPUTpin Voltage.
When the current limiter is active, the device operates in the linear region, so power dissipation may exceed the heatsinking capability. Both case and junction temperatures increase, and if this phase lasts long enough, junction temperature may reach the overtemperature threshold Tjsh.
If Tj reaches Tjsh, the device shuts down whatever the INPUT pin voltage. The device will restart automatically when Tj has cooled down to Tjrs
The VNB14NV04, VND14NV04, VND14NV04-1,VNP14NV04, VNS14NV04, are monolithic devices designed in STMicroelectronics VIPower M0-3 Technology, intended for replacement of standard Power MOSFETS from DC up to 50KHz applications. Built in thermal shutdown, linear current limitation |and overvoltage clamp protect the chip in harsh environments.
Fault feedback can be detected by monitoring the voltage at the input pin.
VND14NV04 Maximum Ratings
Symbol
Parameter
Value
Unit
SO-8
DPAK
TO-220
IPAK
D2PAK
VDS
Drain-source Voltage (VIN = 0)
Internally Clamped
V
VIN
Input Voltage
Internally Clamped
V
IIN
Input Current
+/-20
mA
RINMIN
Minimum Input Series Impedance
10
ID
Drain Current
Internally Clamped
A
IR
Reverse DC Output Current
-15
A
VESD1
Electrostatic discharge(R=1.5 K,C= 100 pF)
4000
V
VESD2
Electrostatic Discharge on output pin only R=330, C=150pF)
16500
V
Ptot
Total Dissipation at TC=25°C
4.6
74
74
74
74
W
EMAX
Maximum Switching Energy (L=0.4mH; RL=0; Vbat=13.5V; Tjstart=150ºC; IL=18A)
93
93
mJ
Tj
Operating Junction Temperature
Internally Limited
TC
Case operating temperature
Internally Limited
Tstg
Storage Temperature
-55 to 150
VND14NV04 Features
During normal operation, the INPUT pin is electrically connected to the gate of the internal power MOSFET through a low impedance path.The device then behaves like a standard power MOSFET and can be used as a switch from DC up to 50KHz. The only difference from the user's standpoint is that a small DC current IISS (typ.100mA) flows into the INPUT pin in order to supply the internal circuitry.
The device integrates: - OVERVOLTAGE CLAMP PROTECTION:internally set at 45V, along with the rugged avalanche characteristics of the Power MOSFET stage give this device unrivalled ruggedness and energy handling capability. This feature is mainly important when driving inductive loads.
- LINEAR CURRENT LIMITER CIRCUIT:limits the drain current ID to Ilim whatever the INPUT pin voltages. When the current limiter is active, the device operates in the linear region, so power dissipation may exceed the capability of the heatsink. Both case and junction temperatures increase, and if this phase lasts long enough,junction temperature may reach the overtemperature threshold Tjsh.
- OVERTEMPERATURE AND SHORT CIRCUIT PROTECTION:these are based on sensing the chip temperature and are not dependent on the input voltage. The location of the sensing element on the chip in the power stage area ensures fast, accurate detection of the junction temperature. Overtemperature cutout occurs in the range 150 to 190 °C, a typical value being 170 °C. The device is automatically restarted when the chip temperature falls of about 15 C below shut-down temperature.
- STATUS FEEDBACK:in the case of an overtemperature fault condition (Tj > Tjsh), the device tries to sink a diagnostic current Igf through the INPUT pin in order to indicate fault condition. If driven from a low impedance source, this current may be used in order to warn the control circuit of a device shutdown. If the drive impedance is high enough so that the INPUT pin driver is not able to supply the current Igf, the INPUT pin will fall to 0V. This will not however affect the device operation:no requirement is put on the current capability of the INPUT pin driver except to be able to supply the normal operation drive current IISS.
Additional features of this device are ESD protection according to the Human Body model and the ability to be driven from a TTL Logic circuit.